研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL Conference 2024 論文集を見る
In modeling of thermal processing of biological materials with rapid evaporation, it is critical to provide boundary conditions consistent with the phenomena happening at the surface to accurately predict spatial temperature and moisture content for quality and safety assurance. Boundary ... 詳細を見る
The sensor type developed by Gunytronic uses corona discharge for measuring flow rates in exhaust streams of automotives, aircrafts and industrial plants. This paper will present the development of testing equipment used in laboratory for investigating physical relations on corona ... 詳細を見る
Ventilation and Indoor Air Quality (IAQ) are issues of very high interest, determining comfortable conditions for occupants and no-contaminated local atmosphere. The aircraft cabins are more confined and have a higher occupant density than other indoor environments such as offices or ... 詳細を見る
An undergraduate course is developed to initiate future engineers to multiphysics numerical simulation by approaching concrete cases in various fields such as: heat transfers, fluid flow, mechanics, chemistry and electrostatics. The so called “Virtual Experiments” course consists of four ... 詳細を見る
This paper presents the use of the multiphysics package COMSOL for teaching heat and moisture transport modeling in the research area of building physics. It includes a description on how COMSOL works and six exercises with 2D, 3D, steady state and transient models. It is concluded that ... 詳細を見る
Scanning electrochemical microscopy (SECM) is a powerful tool recently developed for studying structures and processes in micrometer and submicrometer sized systems. It can probe electron, ion, and molecule transfers, and other reactions at solid-liquid, and liquid-liquid, interfaces . ... 詳細を見る
Cooling of high-power density electronic devices remains a challenge. Microfluidic heat-pipes with the potential of achieving ultra-high thermal conductivities offer a low-cost technology for cooling electronics. To achieve high thermal conductivity, it is critical to maximize the rate ... 詳細を見る
COMSOL Multiphysics is offering an important alternative to home codes for modeling and simulation of complex problems with including coupled effects on heat and mass transfer. The present work focuses on low Prandtl number fluid melts subject to symmetry breaking and transition to ... 詳細を見る
Three-dimensional flow analysis was performed by using COMSOL Multiphysics Chemical Engineering Module for the purpose of analyzing the flow properties and finding out the operating points of a test domain. Using material property table for an exemplary melt of LDPE (Low-Density ... 詳細を見る
Mineral precipitation on to the quartz surface of the lamp jackets in UV disinfection process (fouling) has been recognized as a major problem for UV radiation delivery during disinfection operation. Fouling behavior was observed to be induced thermally and influenced by hydraulic ... 詳細を見る
