研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL Conference 2024 論文集を見る
The well-known Moore’s ‘Law’ sets a target for the down-scaling of silicon-based electronic devices. The down-scaling of devices may provide better performances, such as increased speed and lower power consumption that lead to a lower cost per bit. This is true for the processor ... 詳細を見る
COMSOL Multiphysics® is being utilised to develop Thermal Model for Directed Energy Deposition (DED) process with an objective to analyse the heat transfer phenomenon during and after the process. With the rapid growth of industrial acceptance of DED process, different research ... 詳細を見る
In the design, manufacture, assembly and installation of transformers some of the important requirements are; protection of the environment, operational safety, minimizing maintenance requirements and the risk of fire. Oil insulated transformers have some limitations such as; low ... 詳細を見る
The heat transfer rate and borehole design represent great challenges to thermal equipment designer of the ground-coupled heat pump. The present model represents a mathematical numerical technique implemented to tackle such problem. A thermal assessment was established to estimate the ... 詳細を見る
Seawater can be converted into fresh water using solar energy. This is as an easy, suitable and green solution method to obtain heat for desalination. It is possible to concentrate the sunlight heat flux onto a small focal area by using a Fresnel lens. When the focal area is correctly ... 詳細を見る
Heat cancer therapy (HT) involves increasing tumor temperatures to 40-44°C and is a potent radiosensitizer for the treatment of solid tumors, including brain cancer. Current strategies to heat deep-seated targets in the brain are primarily invasive, and existing HT applicators do not ... 詳細を見る
Micro-transfer printing (MTP) enables mass-transfer of wafer-level chips having lateral dimensions ranging from 3 x 7 um to 650 x 650 um to a nonnative substrate. This is accomplished with an elastomeric stamp containing micrometer scale posts that have been precisely defined using ... 詳細を見る
Elastocaloric heating/cooling takes advantage of the structural changes in shape memory alloys (SMAs) that release and absorb heat when a strain is applied over a transition temperature. Heating/cooling cycles that use SMAs offer a potential solution to issues associated with the use of ... 詳細を見る
Offshore operations, using Robotically Operated Vehicles (ROVs) in areas with high ambient temperatures require ampacity limitations to be established. Specifically, the risk of overheating ROV umbilicals and tethers when running at high power, due to multiple layers on winch drums is a ... 詳細を見る
Innovative materials, such as ultra-high-performance fiber-reinforced-concrete (UHP-FRC), provide an opportunity to reduce building energy loss by developing energy-efficient facade panels. However, investigating the thermal performance of these façade systems without considering the ... 詳細を見る