Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Investigation on MEMS Based Thermal Sensor for Cancer Detection

A. V. Lakshmi[1], K. C. Devi[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

This paper presents the design and simulation of a thermal sensor using COMSOL Multiphysics® software for the detection of low body temperature syndrome which can allow the early detection of cancer. This sensor is made of an alloy consisting of two materials with different coefficients of thermal expansion. The main objective of this work is to investigate the structural change in the sensor ...

Thermal Simulation of FCBGA Package with Heat Sink

M. R. Naik[1]
[1]Nitte Meenakshi Institute of Technology, Bengaluru, Karnataka, India

In a modern IC design, the capability of predicting the temperature profile is critically important as well as cooling and related thermal problems are the principal challenges. To address these challenges, thermal analysis must be embedded within IC synthesis. This paper presents thermal analysis of the FCBGA chip with a 4mm×4mm×0.3mm silicon die. The silicon die dissipates heat flux of ...

FEM Modeling in Robust Design for Graphene-Based Electromagnetic Shielding

S. Elia [1], G. Granata [1], P. Lamberti [1], V. Tucci [1],
[1] University Of Salerno, Italy

Electromagnetic shielding design is usually approached referring to nominal values of the main parameters. This could lead to malfunctioning devices and its performance differ widely from what was really aimed at or, worse, the final design product could even be physically unrealizable. This work presents a robust approach to the design of EM Shielding based on Graphene (Gph) layers. It is a two ...

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

Control of Rolling Direction for Released Strained Wrinkled Nanomembrane

P. Cendula[1], S. Kiravittaya[1], J. Gabel[1], and O.G. Schmidt[1]

[1]Institute for Integrative Nanosciences, Dresden, Germany

Strained wrinkled and flat nanomembranes have different bending properties when they are released from the underlying substrate. This is caused by increased bending rigidity of the wrinkled film in one direction. We provide theoretical and numerical analysis of the directional rolling of wrinkled films, which is important for positioning rolled-up tubes on the short mesa edge during fabrication.

Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics

M. Guvench[1], and J. Crosby[1]
[1]University of Southern Maine, Gorham, Maine, USA

In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of electrical power to displacement force is thermal expansion. A slim beam of MEMS material, typically Silicon, is heated by the application of electrical current via Joule heating; it expands and creates motion. In the design of many MEMS devices ...

Simulation of Topology Optimized Electrothermal Microgrippers

O. Sardan[1], D. Petersen[1], O. Sigmund[2], and P. Boggild[1]
[1]DTU Nanotech, Denmark
[2]DTU Mechanical Engineering, Denmark

In this work, electrothermal microgrippers designed using topology optimization are modeled. The microgrippers are composed of two 5 μm-thick polysilicon actuators facing each other. The gap between the actuators are 2 μm in the initial state and the microgrippers are able to both fully close and further open this gap. The operation principle of the actuators is quite similar to that of a ...

Computational Simulation of Electrohydrodynamic Systems Pertaining to Micro and Nano scale Fluid Flow Phenomenon

M. Seiler[1], and B. Kirby[2]
[1]Department of Engineering Physics, Cornell
University, NY, USA
[2]Department of Mechanical Engineering, Cornell
University, NY, USA

Modeling of 3D AC electro-osmotic pumps is relevant to the creation of portable or implantable lab-on-a-chip devices for mm/s tunable fluid flows attainable with battery scale voltages. In this analysis using COMSOL Multiphysics we investigate the modeling challenges of computationally calculating systems of fluid flow phenomena governed by AC Electroosmosis in the micro and nano scale regimes.

Combined Analytical and Numerical Modeling of a Resonant MEMS Sensor for Viscosity and Mass Density Measurements

S. Cerimovic[1], R. Beigelbeck[2], H. Antlinger[3], J. Schalko[2], B. Jakoby[3], and F. Keplinger[1]
[1]Institute of Sensor and Actuator Systems, Vienna University of Technology, Vienna, Austria
[2]Institute for Integrated Sensor Systems, Austrian Academy of Sciences, Wiener Neustadt, Austria
[3]Institute for Microelectronics and Microsensors, Johannes Kepler University Linz, Linz, Austria

A resonant MEMS sensor for viscosity and mass density measurements of liquids was modeled. The device is based on Lorentz-force excitation and features an integrated piezoresistive readout. The core sensing element is a rectangular vibrating plate suspended by four beam springs. The liquid surrounding the plate influences the resonant behavior of the system. Thus, evaluating the properties of ...

Magnetic Nanoparticles for Novel Granular Spintronic Devices

A. Regtmeier[1], A. Weddemann[2], I. Ennen[3], and A. Hütten[1]
[1]Dept. of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany
[2]Dept. of Elect. Eng. and Comp. Science, Lab. for Electromagnetic and Electronic Syst., MIT, Cambridge, MA
[3]Institute of Solid State Physics, Vienna University of Technology, Vienna, Austria

Superparamagnetic nanoparticles have a wide range of applications in modern electric devices. Recent developments have identi fied them as components for a new type of magnetoresistance sensor. We propose a model for the numeric evaluation of the sensor properties. Based on the solutions of the Landau-Lifshitz-Gilbert equation for a set of homogeneously magnetized spheres arranged in highly ...