Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Design, Simulation and Optimization of Bimorph Piezoelectric Energy Harvester

T. Desai [1], R. Dudhe [1], S. Ayyalusamy [1],
[1] Manipal University, Dubai, UAE

Piezoelectric energy conversion has received great attention for vibration-to-electric energy conversion over the last five years. A typical piezoelectric energy harvester is a unimorph or a bimorph cantilever located on a vibrating host structure, to generate electrical energy from base excitations. In this paper we have optimized the dimensions of the proof mass and the bimorph piezoelectric ...

Detection of Magnetic Particles by Magnetoresistive Sensors

A. Weddemann[1], A. Auge[1], F. Wittbracht[1], C. Albon[1], and A. Hütten[1]
[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

In this work, we demonstrate the implementation of the micromagnetic equations for the description of ferromagnetic thin films in COMSOL Multiphysics®. We apply our model to magnetoresistive sensors consisting of several soft ferromagnetic layers and their response to magnetic particles. The magnetization dynamic of the particles needs to be described in a similar manner, though due to size ...

FEM Based Estimation of Biological Interaction Using a Cantilever Array Sensor

S. Logeshkumar, L. Lavanya, G. Anju, and M. Alagappan
PSG College of Technology
Tamil Nadu, India

In the model silicon nanorods are designed as cantilever array and coated with thin film of aluminum or aluminum nitride, to be characterized, thus, adding a detectable mass and altering the cantilever resistance to bending. The simulated results show that when films of different thickness are placed on the cantilever, there is a corresponding change in the resonant frequency and the ...

Design of a MEMS Resonator for a Centre Frequency Greater than 26.35 MHz and Temperature Coefficient Frequency Less than 0.5 ppm

S.Manikandan[1], R.Radeep krishna[1]
[1]Kalasalingam University, Department of ECE, Srivilliputtur ,Krishnan koil, Tamil Nadu, India

The variability of the design parameters caused by material properties like thermal conductivity is the major challenge in Micro Electromechanical System (MEMS). In resonator design the basic problem is that the frequency changes with temperature variation and quantitative explanation with respect to this varies. The change can be attributed to the stability in terms of frequency drift in parts ...

Design and Simulation of a MEMS Directional Acoustic Sensor

S. L. Pinjare [1], V. S. Nagaraja [1], K. S. Rudresh [1],
[1] Department of ECE , Nitte Meenakshi Institute of technology, Bangalore, Karnataka, India

A Piezoelectric Directional Microphone is demonstrated based on a bio-mimetic design inspired by the parasitoid fly Ormia ochracea using the PiezoMUMPs multi-user foundry. The device simulation was conducted using COMSOL Multiphysics® software which achieves a directional sound field response and frequency band of 3.5 KHz to 4.5KHz. The sensitivity of the device is 3.8nV/pa.

Residual Stress in the Silicon Membrane of Circular CMUT

A. T. Galisultanov [1], P. Le Moal [1], V. Walter [1], G. Bourbon [1],
[1] FEMTO-ST, Besanson, France

During last twenty years capacitive micromachined ultrasonic transducers (CMUT) have been developed extremely fast [1-2]. CMUT is an attractive alternative to traditional piezoelectric transducer, which converts electrical signal to mechanical vibration and vice versa. The main advantages of CMUT compared to most common solution: wide bandwidth (improved image resolution) and compatibility with ...

Design for Reliability and Robustness through Probabilistic Methods in COMSOL Multiphysics with OptiY

T.-Q. Pham[1], H. Neubert[2], and A. Kamusella[2]
[1]OptiY e.K., Aschaffenburg, Germany
[2]Institute of Electro-Mechanical and Electronic Design, TU Dresden, Germany

One challenge in designing micro-electromechanical systems (MEMS) is considering the variability of design parameters caused by manufacturing tolerances and material properties. The function of MEMSs is significantly influenced by this variability, which can be represented in terms of statistical variables. In order to involve statistical design parameters into the design optimization process, ...

Design and Simulation of MEMS based Thermally Actuated Positioning Systems

D. Mallick[1], P. K. Podder[1], A. Bhattacharyya[1]
[1]Institute of Radio Physics & Electronics, University of Calcutta, Kolkata, India

With continuous advancement in nanotechnology, requirement is rising for high precision motion controlled positioning system. Such system plays crucial role in the fabrication of micro and nano-sized objects and assemblies. They can be used for automated mask aligner, as biological sensors, in optical technology as deformable mirrors. Most significant requirements for the actuators in a ...

FEM Modeling in Robust Design for Graphene-Based Electromagnetic Shielding

S. Elia [1], G. Granata [1], P. Lamberti [1], V. Tucci [1],
[1] University Of Salerno, Italy

Electromagnetic shielding design is usually approached referring to nominal values of the main parameters. This could lead to malfunctioning devices and its performance differ widely from what was really aimed at or, worse, the final design product could even be physically unrealizable. This work presents a robust approach to the design of EM Shielding based on Graphene (Gph) layers. It is a two ...

Modeling Directed Self-Assembly of Block Copolymers for Lithographic Applications

A. Fouquet [1], R. Orobtchouk [2], J. Hazart [1],
[1] CEA-LETI, Grenoble, France
[2] Institut des Nanosciences de Lyon (INL), Villeurbanne, France

Nano patterning for chip manufacturing has reached its limitation with 193i lithography standard process. Directed Self Assembly (DSA) of Block Co-Polymers (BCP) is envisaged as an alternative complementary technique that can reduce critical dimension and pitch with high throughput and limited cost [1]. For contact layers that require patterning of cylinders with diameter of tens nanometers, DSA ...