研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL Conference 2026 論文集を見る
There is urgent need to monitor dental and oral diseases, such as tooth decay, gum diseases, and teeth grinding. Such monitoring can be achieved by embedding sensors in the mouth. This technique faces some difficulties. The first is how the power needed for the operation of the sensors ... 詳細を見る
The design of a RFID-enabled temperature sensor is described in this paper. In this sensor, a change in temperature causes structural beams to bend, which results in a proportional displacement of the plates of the capacitor. Plates\' displacement results, in turn, in changing the value ... 詳細を見る
Characterization of particles has numerous applications in science and diagnostics. Recently, particle passage through constrained microchannels has been proposed to characterize particles based on their passage velocity. Nevertheless, there is no clear understanding of how the physics ... 詳細を見る
Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a ... 詳細を見る
This project utilizes the heat transfer module of the COMSOL Multiphysics environment to model the effects that an ohmic heating probe will have on neural tissue. The model quantifies the thermal impact of active components embedded on a neural micro probe by solving the Penne’s bioheat ... 詳細を見る
Voids in composite materials can lead to degraded structural performance. The following is a study of voids or bubbles in uncured viscous polymer resin during composites processing. The goal is to determine if voids can successfully migrate towards vacuum pathways, coalesce with the ... 詳細を見る
The rapid increase in power densities of integrated circuits has induced a significant interest in new reliable and high heat flux cooling technologies. The implication of such growth is the increased need for more efficient and more compact cooling mechanisms. Promising research has ... 詳細を見る
A scheme for inductive wireless powering and readout of passive LC sensor is presented. The sensor’s inductor is designed as a planar square coil and is used as the power receiving component. The capacitor is connected directly to the inductor and it was designed as an interdigital ... 詳細を見る
