研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL コンファレンス 2020 論文集を見る
Designing the Actuator for the Next-Generation Astronomical Deformable Mirrors: a Multidisciplinary and Multiphysics Approach
The actuation system of the deformable mirror is one of the crucial components of an Adaptive Optics unit. One possible implementation comprehends a linear force motor and a capacitive sensor providing the feedback measure signal. Choosing a magnetic circuit that makes optimum use of the ... 詳細を見る
Simulation of the Dynamic Behavior of a Droplet on a Structured Surface using the Non-conservative Level Set Method
The ongoing trend towards miniaturization, higher integration as well as cost efficiency will make it necessary to investigate a new assembly method for micro components. In this paper, a novel method of fluidic-based micro assembly is presented. A self-assembly effect which is caused by ... 詳細を見る
Acoustic-Structure Interaction Simulation of a Differential Phase Sensor
The idea of application as a hearing device based on a parasitoid fly, Ormia ochracea has been studied extensively recently. This paper addresses another possible application as an underwater directional sensor. In order to study the feasibility of the application, it is necessary to ... 詳細を見る
Simple Finite Element Model of the Topografiner
In our recent experiments we are revisiting the topografiner technology for the imaging of surface topography with a resolution of a few nanometers. In these new technique called Near-Field Emission Scanning Electron Microscopy (NFESEM), low-energy electrons are emitted from a ... 詳細を見る
Heterodimensional Charge-Carrier Confinement in Sub-Monolayer InAs in GaAs
Low-dimensional semiconductor nanostructures, in which charge carriers are confined in a number of spatial dimensions, are the focus of much solid-state physics research, offering superior optical and electronic properties over their bulk counterparts. Both two-dimensional (2D) and zero ... 詳細を見る
Finite Element Analysis of Temperature and Viscosity Effects on Resonances in Thin-Film Bulk Acoustic Wave Resonators
The shear mode of film bulk acoustic resonators (FBARs) is preferred to the longitudinal mode owing to its lower acoustic losses in a liquid. However in addition to mass loading, the resonance is also affected by temperature and liquid viscosity. These two parameters can either be sensed ... 詳細を見る
Plasmonics of Nano-Gaps
Plasmons, i.e. the collective oscillations of electrons in a metallic nano-structure, lead to strong light scattering, absorption and an enhancement of the local electromagnetic field. In this work, the local electric-field enhancement in a system of dielectric nanoparticles placed ... 詳細を見る
Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits
Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have ... 詳細を見る
Air Damping Simulation of MEMS Torsional Paddle
Viscous damping has a significant effect on dynamic performance of the resonators operating within fluid. This work is aimed to find the viscous damping for MEMS torsional paddle operating in air. Interaction of moving structure with the fluid requires a complicated and challenging ... 詳細を見る
MEMS Acoustic Pixel
A COMSOL Multiphysics® simulation was used to simulate the behavior of a micro-membrane (Acoustic Pixel) to be used as a potential acoustic transducer. The MEMS and Piezoelectric devices interfaces were used to simulate such transducer. A four-cantilever spring configuration is initially ... 詳細を見る