研究開発におけるマルチフィジックスシミュレーションの具体例
マルチフィジックスモデリングとシミュレーションは, 産業界や学術界のさまざまな分野でイノベーションを推進しています. そのことは, 毎年 COMSOL Conference でエンジニア, 研究者, 科学者が発表する技術論文やポスターで紹介される数多くの活用事例からも明らかです. 以下にまとめられた最近の講演論文集から新たなアイデアやヒントを得たり, クイック検索ツールを使用して特定の発表を検索したり, アプリケーション分野, カンファレンスの開催年や開催地で絞り込んだりできます.
COMSOL Conference 2026 論文集を見る
In this work, we show that dipolar magnetic coupling can be used to control the particle flow through microfluidic structures without changing the state of motion of the carrier liquid. Also no external magnetic gradient fields are employed; the total external magnetic force applied is ... 詳細を見る
Since a couple of years, sintering becomes more and more important for power electronics. To press a semiconductor under high temperature in silver paste on a substrate promises benefits for durability. Tests with semiconductors of different thickness expose some problems. After the cool ... 詳細を見る
Microreactors are important alternative to conventional reactors in chemistry, chemical, pharmaceutical and semiconductor industries due to their operation characteristics such as increased mass and heat transfer, uniform flow, safety, high throughput through array configurations, ... 詳細を見る
Rotaxanes are a class of molecules recently developed in laboratory that have been heralded as possible molecular motors. The motor is constituted by a linear molecule (thread) and a ring-shaped molecule (macrocycle), which is free to move along the thread, switching between two, or ... 詳細を見る
The current paper focuses on the creation of a consistent environment for the numerical prediction of the physical properties of polymer composite. A limitation factor for the successful simulation of composite processes is the correct estimation of the effective properties depending on ... 詳細を見る
A ball is in contact with a plane, and a lubricant separates the two surfaces to decrease friction during their relative motion. To avoid wear, the lubricant film thickness should be higher than the surface roughness. The goal of this paper is to show how it is possible to solve ... 詳細を見る
In this work, an electrostatic diaphragm micropump is investigated by means of COMSOL Multiphysics®. A fluid-dynamic model is adopted to evaluate the fluid flow characteristics inside the pumping chamber, in static conditions. In parallel, electromechanical quasi-static simulations ... 詳細を見る
In this paper, after a brief presentation of our company, we will detail our technology and the importance of the simulation step. In the same time, we will describe different levels of FEA (Finite Element Analysis) we have followed and we will conclude on the best balance, for our ... 詳細を見る
