研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL コンファレンス 2020 論文集を見る
A Multiscale Approach to Simulate Vacuum Drying of a Packed Bed of Spray-Frozen Particles
Preservation of biopharmaceuticals by spray freeze-drying is of great interest as it involves gentle drying and can be easily integrated with continuous manufacturing strategies. The drying of packed beds have been extensively studied experimentally, but a detailed mathematical model of ... 詳細を見る
Simulation of Through Air Drying in Tissue Paper in a Papermaking Process
Water removal during paper and board manufacturing is an intensive energy process. The dewatering process generally consists of four stages wherein the last stage is comprised by thermal drying in where remaining water in fibres are evaporated on steam-heated cylinders. The thermal ... 詳細を見る
2-D Ion Transport Modelling of Water Desalination by RO System Considering the Real Membrane Effect
Modern composite membranes for reverse osmosis (RO) and nanofiltration (NF) have an ultrathin polyamide active layer (~100 nm) that performs the ion separation. Current theoretical models explain solute and water fluxes by computing concentration and potential gradients developed in one ... 詳細を見る
Numerical Simulation of the One-Way Mechanical-Electrochemical Coupling in Structural Supercapacitor
Structural Supercapacitors (SSC) are an important group of Multifunctional Energy Storage Composites (MESC) and can potentially play a significant role in lightweight design of aerospace and automotive applications [1]. Therefore, it is important to build accurate models based on the ... 詳細を見る
Modeling Electrochemical Deposition of Aluminum from Ionic Liquids for PCB Applications
While copper remains the dominant material for conduction paths in printed circuit board (PCB) applications, both technological and economic reasons have been motivating research on substituting copper with aluminum (Al). Despite its 60 % higher specific electrical resistance, aluminum ... 詳細を見る
3D Numerical Simulation of Resistance Sintering for Electrical Contact Applications for Breakers
In circuit breakers, short-circuit breaking involves extreme conditions linked to the presence of an intense electric arc. This requires the use of specific electrical contacts consisting of a contact tip and its support. SCHNEIDER ELECTRIC uses the resistance sintering technique for the ... 詳細を見る
Optimal Design of Baking Plates for an Inductive Wafer Baking Oven
Baking is a central production step in the industrial production of edible wafers and waffles. The initially liquid batter is heated with a pair of metallic baking plates. Establishing a uniform and accurate temperature at the baking face (inner baking plate surface) is crucial for ... 詳細を見る
Efficient Geothermal Cooling in Harsh Environments: A Combined Experimental and Modelling Approach
In this work we present a novel approach to enhance energy efficiency in cooling intake air for air conditioning (AC) systems in harsh environments using geothermal energy. We developed a 3D finite element model to simulate the heat transfer between underground soils/gravels and cooling ... 詳細を見る
Multiphysical Optimization of the Next Generation of Energy Efficient High Temperature Furnaces
To achieve the goals of the Paris Agreement and limit global warming below 2 K compared to pre-industrial level, significant energy savings in all fields of industries will be required. One example of energy intensive processes in industrial fabrication is heat treatment. The applied ... 詳細を見る
Interaction of the Laser with the Material Modelling of the Micro-Lenses Creation
Micro-lenses with potential applications in optics on the surface of the various heavy-metal oxide glasses were created and studied experimentally [1-2]. Laser direct writing using continuous-wave laser emitting at 447 nm was successfully performed [2]. The aim of this study is to ... 詳細を見る