研究開発におけるマルチフィジックスシミュレーションの具体例
マルチフィジックスモデリングとシミュレーションは, 産業界や学術界のさまざまな分野でイノベーションを推進しています. そのことは, 毎年 COMSOL Conference でエンジニア, 研究者, 科学者が発表する技術論文やポスターで紹介される数多くの活用事例からも明らかです. 以下にまとめられた最近の講演論文集から新たなアイデアやヒントを得たり, クイック検索ツールを使用して特定の発表を検索したり, アプリケーション分野, カンファレンスの開催年や開催地で絞り込んだりできます.
COMSOL Conference 2026 論文集を見る
The development of microfluidic components for implementation of a lab-on-chip system requires both fluid movements under a controlled environment as well as sensitive detection. This work involves the design and simulation of micro-reactors with integrated heating as well as optical ... 詳細を見る
The aim of this work is to investigate the impact of the structural parameter on the signal of the impedance based microfluidic flow cytometer for cell detection. A well-established optical technique for counting, identifying and sorting cells is flow cyto-fluorimetry, which is an ... 詳細を見る
Rebar detectors are used extensively by construction contractors to locate rebars while drilling, coring or cutting in RCC to avoid causing damage to the reinforcement steel. These detectors are also used by inspection engineers for spot checking of civil infrastructure. Most cost ... 詳細を見る
Manufacturing of an apparatus for experimental purpose pose certain difficulties due to the process involved. For a 20L perfect sphere, manufacturing by forging or any other process is not economical, due to which the equipment is manufactured with modified dimensions. This paper aims to ... 詳細を見る
Undesirable shocks and vibrations are a noteworthy issue in numerous human exercises and domains. Therefore, various damping techniques are used to minimise vibrations, can be classified as active, Semi-active and passive damping. The development of semi-actively controlled ... 詳細を見る
Introduction In this work, we will present an equation based technique for MOSFET simulation in COMSOL 5.4 and will discuss about the challenges faced in doing the same. The idea behind such a methodology is to demonstrate the coupling of the existing semiconductor equations with ... 詳細を見る
Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to achieve “more than Moore” integration. Conventionally, Copper (Cu) is used as a TSV material. However, due to rapid scaling of interconnect, problems like electro-migration and surface ... 詳細を見る
Fiber Reinforced Polymer (FRP) laminated composites have extensive application in the field of aerospace, marine, sports, bio-medical and lot more. FRP is mostly utilised for its high strength to weight ratio. Since, its failure is catastrophic in nature. There is need to study its ... 詳細を見る
