研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL Conference 2024 論文集を見る
The experience of the eruption in Montserrat in 1997 has shown that the resistance of openings of buildings represents a crucial factor in the evaluation of vulnerability to the stresses caused by pyroclastic flows, although the static nature of the building itself is not compromised. ... 詳細を見る
To achieve the goals of the Paris Agreement and limit global warming below 2 K compared to pre-industrial level, significant energy savings in all fields of industries will be required. One example of energy intensive processes in industrial fabrication is heat treatment. The applied ... 詳細を見る
Microfluidics and Biosensors are two principal fields that paved the way for the inception of Lab-on-a-chip (LOC) which provides early and cost-effective disease detection, from monitoring to treatment. LOC is a device that uses very small amounts of fluid on a microchip to do certain ... 詳細を見る
In this conference we have brought together a community that is scientifically diverse in an event that allows for inspiring contacts about the use of COMSOL Multiphysics. It is an event to connect with the Spanish and Portuguese COMSOL Multiphysics users and participate in training ... 詳細を見る
Over the past 10 years, scientific, technical, and technological advancements have significantly propelled the integration of artificial intelligence and machine learning technologies within the field of physics, particularly in numerical simulations and the design of autonomous and ... 詳細を見る
Flexible and semi-rigid polyurethane foams are widely used as noise and vibration damping materials. Their porous random microstructure is composed of a visco-elastic frame structure with an interstitial fluid, normally air, filling the voids. The viscoelasticity of the foams is due to ... 詳細を見る
The Bridgman process is used in the production of single crystal superalloys for use in high temperature applications. The mechanical properties of these superalloys are strongly influenced by the microstructure that is formed during the solidification. The formation of the ... 詳細を見る
In the sphere of pasta drying, where accurate prediction of temperature and moisture distribution is crucial, the application of modeling and simulation emerges as highly significant. This work focuses on the development of a physical-mathematical model capable of estimating the space ... 詳細を見る
In power electronics applications, microelectronic chips face swift temperature changes during operation, characterized by heat pulses of sub-millisecond duration with temperatures rising by hundreds of Kelvin. Over time, these conditions may lead to degradation in the metallization ... 詳細を見る
COMSOL® models of basal body deformation using the Beam Interface are compared to electron tomograms of Tetrahymena thermophila basal bodies high-pressure frozen while undergoing beating deformation. This approach provides insight into the nanoscale structures and internal forces ... 詳細を見る