研究開発におけるマルチフィジックスシミュレーションの具体例
マルチフィジックスモデリングとシミュレーションは, 産業界や学術界のさまざまな分野でイノベーションを推進しています. そのことは, 毎年 COMSOL Conference でエンジニア, 研究者, 科学者が発表する技術論文やポスターで紹介される数多くの活用事例からも明らかです. 以下にまとめられた最近の講演論文集から新たなアイデアやヒントを得たり, クイック検索ツールを使用して特定の発表を検索したり, アプリケーション分野, カンファレンスの開催年や開催地で絞り込んだりできます.
COMSOL Conference 2026 論文集を見る
The anode baking process has gained significant attention since the 1980s due to its importance in Aluminium industry. A good anode baking process strives to achieve multiple goals including reduction of NOx from emissions. NOx generation is mainly due to the high-temperature ... 詳細を見る
Seasonal thermal energy storage (STES) systems are key components for expanding the renewables share in the energy scheme as they offer the dispatchability and flexibility. Therefore, thermal behaviour of such systems is of interest. STES can influence the surroundings causing a ... 詳細を見る
Non-contacting guided wave tomography based on laser ultrasonic waves can be used to inspect structures that are inaccessible to traditional ultrasound methods. Such structures could be, chemically or physically hard to reach, e.g. hot metal structures, metal implants inside tissue or ... 詳細を見る
Whispering-gallery mode resonators (WGR) are promising elements for future photonic devices, as they combine ultra-high quality factor with small size and mode volume. Many practical applications of such microresonators, such as ultra-sensitive chemical and biological sensors [1] electro ... 詳細を見る
The interaction of high power laser beam with metallic materials produces a number of interconnected phenomena that represent a serious challenge for numerical modeling, especially for creation of auto-consistent models. Additional difficulty consists in lack of data on materials ... 詳細を見る
Through Silicon Via (TSV) is one of the key technologies for 3D integration. It is a vertical electrical connection that passes through a silicon wafer and establishes the signal transmission between the front and the backside of the device. In the so-called “TSV last” integration ... 詳細を見る
Introduction With the vast development in the aerospace industry it is inevitable that currently used materials such as Nickel based super alloys will soon reach its peak performance. Hence developing alternative materials with similar properties that could be enhanced further is ... 詳細を見る
A concept of an adaptive sound absorbing material is proposed and investigated numerically using the COMSOL Multiphysics® Software suitable for the required advanced dual-scale modelling which involves solution of various problems of physics at the microscopic and macroscopic levels. A ... 詳細を見る
