研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL Conference 2024 論文集を見る
Dr. Tewari is an Associate Professor in the Department of Mechanical Engineering at IIT Bombay. Prior to this he was a staff researcher at the General Motors Global R&D Center, Bangalore. He graduated with a B.Tech degree from IIT Kanpur followed by an MS and Ph.D. from Georgia ... 詳細を見る
Dr. Leewood joined MED Institute (a Cook Medical Company) in January 2004. He came to MED from AC Engineering, Inc.(ACE) which he founded in 1986. ACE provided consulting services in the field of Computer Aided Engineering with specialty in solving a wide range of industrial problems ... 詳細を見る
William T. Vetterling, Ph.D., is a Research Fellow of ZINK Imaging, Inc. and manager of its Image Science Laboratory in Bedford, Massachusetts. He received his Ph.D. in condensed-matter physics from Harvard University, and joined the Harvard faculty in 1976. In 1984 he began working with ... 詳細を見る
Ercan Dede currently works as a Principal Scientist for the Toyota Research Institute of North America, where his research involves the multiphysics simulation and optimization of electromechanical systems for advanced vehicle applications. Dr. Dede received his Ph.D. and B.S., ... 詳細を見る
Grating-assisted optical coupling into long-range modes of strip plasmonic waveguides is analyzed by a 3D numerical simulation with COMSOL Multiphysics. We used the RF Module and its scattering formulation. A comparison with results obtained using the common 2D approximated analysis is ... 詳細を見る
This work focuses on the application of multiphysics finite element simulations in the manufacturing and application of high power ultrasonic machines. Industries providing big power ultrasonic solutions as in cleaning, welding, sonochemistry and cutting fields, already apply the finite ... 詳細を見る
In this paper we want to figure out the development of a capacitive acceleration-sensor system with the FEM-Method. The sensor-system is in the position to detect accelerations in the range of ±20 g. Furthermore the sensor-element contains a printed RF-inductance, which is used for ... 詳細を見る
It is now a well known that the next generation devices in many fields of the semiconductor industry will be based on 3D architectures. In this framework, low thermal budget annealing technological solutions are required. For many applications, either in the field of sensors, ... 詳細を見る
COMSOL, adding SPICE® elements into its FEM, gives the possibility of a direct modeling of oscillators: triode and load are FEM described while all the other components of the circuit are just simulated using SPICE®. The modeling is not a straight application of any module but needs the ... 詳細を見る
In this work, we present a number of scoping calculations that have been carried out to design an in-situ redox experiment (Figure 1) focused on assessing potential changes in the pH and redox conditions and in the buffering capacity of the Olkiluoto bedrock (i.e. the site for the ... 詳細を見る
