研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL カンファレンス 2024 論文集を見る
In modern hearing aids, the performance of directional microphone systems is dependent on both the acoustics around thehearing aid and on the specific signal processing algorithms. The sound pressure at the microphone inlets depends on microphone location in the hearing-aid shell, the ... 詳細を見る
A solidification process of casting explosives in shell is studied in this paper. An enthalpy method approach is used to model the solidification process. Both the thermal and mechanical effects are taken into account. An ALE (Arbitrary Lagrangian-Eulerian) method is used to represent ... 詳細を見る
Outline of presentation: Comsol is a very flexible platform, ideal to model rheology modification under flow Analogy with reactive flows allows modeling of both thixotropy and gelation with decent level of accuracy and predictability It is possible, to a certain extent, to use 1D ... 詳細を見る
The research project under which the COMSOL simulations are performed deals with multilayer and fine thermal control of an optical reference cavity for space applications. The cavity, made of Ultra Low Expansion glass (Corning ULE), must be kept close to the zero expansion temperature of ... 詳細を見る
In this paper a methodology for calculating the infrared signature of complex objects is presented. The transient thermal analysis allows us to evaluate the temperature distribution on the investigated object, pointing out which parts tend to be warmer. These temperature values are ... 詳細を見る
Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification in free energy density finite element implementation: PDE form weak form periodic boundary conditions: electrical mechanical domain configurations intrinsic and extrinsic ... 詳細を見る
Svante Littmarck is the CEO of the COMSOL group. He co-founded COMSOL in 1986. He holds a M.Sc. in Applied Mathematics from the Royal Institute of Technology in Stockholm. In 2004 he received an honorary doctoral degree from the Royal Institute of Technology. 詳細を見る
The hot stamping of boron steels for producing complex structural components of the car body-in-white is more and more widespread. Optimization of sheet forming technologies at elevated temperatures is still troublesome, since the thermal, mechanical and metallurgical phenomena ... 詳細を見る
The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured ... 詳細を見る
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... 詳細を見る