研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL Conference 2024 論文集を見る
Currently there is much interest in electromagnetic metamaterials [1-9]. In our work we have focused on design of tunable metamaterial which can be made within available technology. In proposed design we use metallic split-ring resonators and thin-wires (Figure 1). Moreover we have ... 詳細を見る
PEM fuel cells are very promising for portable applications. A key component of fuel cell is the flow field plate through which hydrogen will reach the anode, oxygen will reach the cathode and electron collection. Flow field plate made of silicon is not a good electrical conductor , so ... 詳細を見る
This work presents acoustic attenuation performance of helicoidal resonator due to distance change from different cross-sectional elements of cylindrical duct. The helicoidal resonator properties are described mainly in in infinite long cylindrical duct. For practical applications it is ... 詳細を見る
This paper describes the numerical modeling of a key material-stability issue within the realm of Molten Carbonate Fuel Cells (MCFC). The model describes the morphological and attending electrocatalytic evolution of porous NiO electrodes and is apt to predict electrochemical observables ... 詳細を見る
Variable capacitors between the fF and pF range are very interesting for high frequency applications like variable filters, resonators, etc. For radio astronomy applications variable capacitors, realized by electrostatically actuated, micromechanical Meanders-suspended bridges (MEMS) ... 詳細を見る
COMSOL, adding SPICE® elements into its FEM, gives the possibility of a direct modeling of oscillators: triode and load are FEM described while all the other components of the circuit are just simulated using SPICE®. The modeling is not a straight application of any module but needs the ... 詳細を見る
The novel Micro Electro Mechanical System (MEMS) based Piezoresistive stain sensor is presented in this paper. The main goal of this sensor is to monitor the localized strain in the highway bridges especially near the crack tips. Monitoring the crack growth on the bridges can lead to ... 詳細を見る
Susceptors are very thin metallic microwave absorbing films used in microwaveable food packaging. They tend to heat up very rapidly during microwave heating and this effect helps to overcome two major issues faced in domestic microwave ovens; 1) Non-uniform heating and 2) lack of ... 詳細を見る
Syntactic foams are hollow particle filled composites that have recently emerged as attractive materials for use in advanced structural applications in aerospace and defence industry. Ultrasonic characterization of these foams is performed extensively in order to understand the effect ... 詳細を見る
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... 詳細を見る
