研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL カンファレンス 2024 論文集を見る
Energy harvesting from environmental vibration nowadays is feasible because of natural oscillations like that caused by air or liquid flow and by exhalation or the heartbeat of a human body. This vibration frequency is typically low (in order of less than 1 kHz). Accordingly, low ... 詳細を見る
The main aim of the present work is the study of the thermal and energy performances of the new hall of the Old St.Maria Nuova Hospital in the center of Florence (Italy). Transient simulations were carried out of the 3D model of the hall to analyse the air flow patterns, distribution and ... 詳細を見る
Over the past few decades, nano/micro-mechanical resonators have experienced tremendous improvements in measurement sensitivity. In order to ensure accuracy, it is crucial that each nano/micro-mechanical device is properly calibrated. Thermomechanical calibration provides a noninvasive ... 詳細を見る
There has been growing demand for high performance micro sensors capable of detecting nuclear radiations being released from various industries, Nuclear reactors. Radiations emitted from the radioactive materials are invisible and not directly detectable by human senses. Thus it is ... 詳細を見る
Heterogeneous materials with different phases, are conductive and insulating (dielectric), and are physically present in different natural materials as e.g. atmospheric ice. Jonscher’s proposed ‘universal dielectric response’ is not sufficient for such materials, as it only reflects ... 詳細を見る
This paper presents finite element method (FEM) simulation study of the generation of bulk acoustic waves (BAWs) and their effect on the performance of surface acoustic wave (SAW) devices, using COMSOL Multiphysics. A SAW delay line structure using YZ-cut lithium niobate substrate is ... 詳細を見る
The silicon diaphragm is one of the most common structures in Micro-Electromechanical Systems (MEMS). However, it is susceptible to creep deformation at elevated temperatures. This paper presents a transient finite element model which simulates the mechanical behavior of the ... 詳細を見る
An FEA model of a steady state thermal interface material characterization apparatus was created in COMSOL Multiphysics 4.2a. This model was then fitted using three convection heat loss coefficients and the conductance of the TIM layer to a set of experimental measurements made using a ... 詳細を見る
Circuit board failures are often ignored because they could be impreceptible. This simulation examines how internal layers around a soldered pin via subject to temperature changes during the soldering process are affected, show the forces involved and determine breaking points. A 2D ... 詳細を見る
In this project, we report a design of MEMS microphone that is based on the application of porous silicon in improving the sensitivity of bulk micro machined capacitive pressure sensors. The property of a low Young’s modulus of porous silicon and its dependence on porosity have been ... 詳細を見る