研究開発におけるマルチフィジックスシミュレーションの具体例

さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.


COMSOL コンファレンス 2020 論文集を見る

Structural Mechanics and Thermal Stressesx

Multiphysics Modeling Results for the High Flux Isotope Reactor to Support its LEU Conversion

Prashant K. Jain1, Marta Sitek2
1Oak Ridge National Laboratory
2Argonne National Laboratory

Ongoing engineering design studies at Oak Ridge National Laboratory are exploring the feasibility of converting the High Flux Isotope Reactor (HFIR) from highly enriched uranium (HEU) to low-enriched uranium (LEU) fuel. HFIR is a pressurized light water-cooled and moderated research ... 詳細を見る

Analysis of Contact Stiffness in Hammer to Anvil Collision for Pyroshock Purposes

Alessandro Daga1, Luca Viale1, Luigi Lentini1
1Politecnico di Torino

When dealing with space and aerospace equipment, their ability to withstand the strong excitations produced during the launch must be tested by the manufacturers according to international standards requirements. In fact, structural subsystems of the rockets are commonly released by ... 詳細を見る

Analysis of the Stress and Load Distribution of an Assembled Screw Including Threaded Contact

C. Hollenbeck1
1IMAGINE Engineering GmbH, Bergheim, Germany

There are different possibilities to simulate a bolted joint. If only the connection of parts in an assembly with the stress distribution and surface pressure between the components without the bolt itself is of interest, the thread of the bolt is omitted and only the effect of bolted ... 詳細を見る

Dynamic Characterization of Elastomeric Rings

Luigi Lentini1
1Politecnico di Torino

Elastomeric elements are currently used as external dampers in many applications to increase the stability of dynamical systems, e.g., rotor-bearings systems. However, the dynamic design of systems embedded with elastomeric dampers is a hard task, since the properties of this kind of ... 詳細を見る

Fully Automated FE-Application

D. Fischer1, P. T. Tauer1
1Lauterbach Verfahrenstechnik GmbH

The new FE Toolbox from Lauterbach Verfahrenstechnik GmbH combines precision and user-friendliness in one application. Our tool is tailor-made to reliably achieve a fast and accurate design of various components in pressure vessel design and plant design. With COMSOL Multiphysics we have ... 詳細を見る

Investigation of the Crystalline Lens Inertial Overshooting: Ex Vivo and Simulation Results

Ali Dahaghin1, Milad Salimibani1, Agnieszka Boszczyk1, Agnieszka Jozwik1, Damian Siedlecki1
1Department of Optics and Photonics, Wroclaw University of Science and Technology, Wroclaw, Poland

For the purpose of investigation the inertial behaviour of the crystalline lens, the COMSOL Multiphysics® software was used to create a 2D multi-physics model of the porcine eye globe, by using the Fluid-Structure Interaction (FSI). The geometry of the porcine eye model was adapted from ... 詳細を見る

Prediction of Douglas-Fir Sawn Timber Strength based on X-ray Computed Tomography and FEA

Boris Sandor1, Andreas Weidenhiller1
1Holzforschung Austria

Due to climate change impacts and the worsening growth conditions of Norway spruce (Picea abies) the species composition of European forests is being diversified, incorporating more hardwoods as well as drought-resistant softwood species, such as Douglas-fir (Pseudotsuga menziesii). As a ... 詳細を見る

Predictive Simulations of Warpage Phenomena on Arbitrarily Patterned Silicon Wafers

Filippo Sabatini1
1Politecnico di Milano, ST Microelectronics

In this simulation, we aim to comprehend the origin and mechanism of the warpage phenomenon in patterned silicon wafers, which are key components in the field of microelectronics. This issue can become more pronounced in the presence of high global density of the patterns and can lead to ... 詳細を見る

Two-Scale Modeling Of The WAAM Process: Link Between Thermo-Hydrodynamics And Mechanics

S. Cadiou1, C. Le Falher2, S. Morville2, M. Courtois1, P. Paillard3, P. Le Masson1
1Univ. Bretagne Sud, UMR CNRS 6027, IRDL, F-56100 Lorient, France
2Nantes Université, IRT Jules Verne, F 44000 Nantes, France
3Nantes Université, CNRS, Institut des Matériaux de Nantes Jean Rouxel, IMN, F-44000 Nantes, France

Simulation of arc-wire additive manufacturing is under development in many academic and industrial sectors and at different scales. The study at the melt pool scale is often interesting to study deposition shapes and defects but not very relevant to calculate the stresses and strains at ... 詳細を見る

Wire Bonding: A Thorough Numerical Methodology

Beatrice Carasi1, Lucrezia Guarino1, Lucia Zullino1, Luca Cecchetto1
1STMicroelectronics

The semiconductor industry is always looking for early anticipation of manufacturing risk, pushing the development of Computer Aided Engineering (CAE) modeling of processes. Robust Chip-Package Interaction requires a deep understanding of thermo-mechanical stresses imposed during the ... 詳細を見る