研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL カンファレンス 2024 論文集を見る
A 3D thermo-mechanical simulation was developed using COMSOL Multiphysics software in order to predict distortion of a welded dissimilar titanium alloys structure. An angular distortion and a longitudinal shrinkage are predicted in agreement with those obtained experimentally. 詳細を見る
Electroacoustic resonators employing surface acoustic waves (SAW) are commercially widely used in RF filters, low noise frequency sources as well as various sensors. In all of these applications the resonance quality factor appears to be a limiting performance factor. Quite often ... 詳細を見る
A 1D-axisymmetric model was built to represent the drying of a single d’Ente plum to d’Agen prune. Underlying assumptions of the model were those of Di Matteo et al. 2003. Sorption isotherms of plum come from Tsami et al, 1990 and equation structure of apparent water diffusion ... 詳細を見る
The aim of the simulation is to study the behavior of a particular arrangement of a sealing system made of a Toroidal Spring Coil encapsulated in an thin casing, which is provided with a circumpherential cut to permit the pressure fill it inside. The mechanical simulation implemented ... 詳細を見る
Electromigration induced failure is one of the main reliability issues for the microelectronics industry. The continuous scaling of the interconnect dimensions leads to higher operating current densities and temperatures, which accentuates the electromigration failure. As a consequence, ... 詳細を見る
Adaptive Optics is common sense, since many people use digital cameras with electromechanical iris actors on elastic autofocus lenses. This project tries to create a COMSOL Multiphysics based mathematical model of adaptive optics with electrostatically induced deformation of dielectric ... 詳細を見る
Silicon wafers represent key elements in modern microelectronics or photovoltaics. Technological fabrications of wafer sizes with large diameters (e.g. 450 mm) allow an efficient realization for integrated circuits at low cost. However, this material shows a high sensitivity to ... 詳細を見る
The "Lithic Hypar" research is based on the mechanical analysis of an innovative reinforced stone's structure, architecturally designed by Prof. Fallacara, University of Bari (Italy): the headquarters entrance portal of the French company SNBR (Société Nouvelle Batiment Régional) located ... 詳細を見る
Electronic devices produce a very high rate of specific heat with respect to their dimensions. Exceeding in maximum safe operating temperature means strong reduction of efficiency, reliability and lifetime. In addition, electronic devices are subjected to periodical thermal loading. ... 詳細を見る
The design of ESS-Bilbao RFQ (RadioFrequency Quadrupole) linear accelerator cavity using COMSOL Multiphysics is presented. The work includes geometry definition, electrostatics, electromagnetic and thermomechanical coupled simulations. The main part of the work corresponds to the ... 詳細を見る