Giuseppe Petrone, BE CAE & Test, Italy
BE CAE & Test, a COMSOL Certified Consultant, created a thermal model of a surface-mount device for a client and converted it into a simulation app with the Application Builder in COMSOL Multiphysics®, providing an interactive deliverable that could be used to investigate the system. Their clients are pleased to use an interactive tool with which they can investigate their system.
In the simulation app, the end user can vary the material of the solder layer and silicon die, thickness of the solder layer, and dissipated thermal power to examine the impact on maximum junction temperatures and junction-to-case thermal resistance.
Suggested Stories
Pushing the Limits of Chip Density
Chip manufacturers have been adhering to Moore’s law, a law stating that the number of transistors that can be ...
Innovative Motor Designs for Electric Cars Come to Life
If electric vehicles are to ultimately transcend from niche to mainstream, their motor designs must continually ...
How Reclosers Ensure a Steady Supply of Power: It’s All in the Magnet
When a tree branch touches overhead cables and causes a momentary short circuit, your lights may flicker. A device ...
EPFLで未来のために設計する若いエンジニアに刺激を
スイス連邦工科大学ローザンヌ(EPFL)のEPFLoopはマルチフィジックスシミュレーションの助けを借りて 2018 SpaceX ハイパーループポッドコンペティションのためにポッドを設計しました. 彼らは世界のトップ3チームに入り, ...
