Modeling Semiconductor Packaging in COMSOL Multiphysics®
Semiconductor packaging is a critical step in the development of modern electronic devices, influencing their performance, reliability, and thermal management. The complexity of packaging technologies has grown significantly with the demand for miniaturization, higher power densities, and improved mechanical and thermal robustness. Addressing these challenges requires a comprehensive understanding of the multiphysics interactions within semiconductor packages, including electromagnetics, heat transfer, structural mechanics, and fluid dynamics.
In this archived webinar, we explore how multiphysics simulation enables engineers to analyze and optimize semiconductor packaging designs, including advanced packaging, under realistic operating conditions. We showcase a variety of simulation models in the COMSOL Multiphysics® software that feature different aspects of semiconductor packaging — such as thermal dissipation strategies, stress analysis, electromigration risks, and signal integrity — and highlight the benefits of an integrated modeling approach for improving design efficiency and reliability.
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