Convective Flow in a Heat Exchanger Plate
Application ID: 12153
This example models flow in a microchannel heat exchanger by coupling a Laminar Flow interface in 3D to a Pipe Flow interface. By the use of the Pipe Flow interface to model the flow in the microchannels the problem size is significantly reduced.
This model showcases the Pipe Connection feature that automatically connects a 3D and and Pipe Flow domain.
This model example illustrates applications of this type that would nominally be built using the following products:パイプ流れモジュール
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the 製品仕様一覧 and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.