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This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the ... 詳細を見る
The inductor is a common component in a variety of electrical devices. Its applications include power transformation and measurements, and it can also be used together with capacitors to create oscillators. In small devices with many components, such as in laptops, heat generation can ... 詳細を見る
This model is an introduction to defining and verifying a satellite orbit, and computing the solar, albedo, and Earth infrared thermal loads. A 1U CubeSat is in a circular orbit at 400km altitude, inclination of 50°, and longitude of ascending node of 0°. The satellite is rotating slowly ... 詳細を見る
The heat transfer rate and hydraulic resistance of a three dimensional heat exchanger is optimized in the laminar flow regime. 詳細を見る
This example models heat transfer in a thin rectangular metal plate. Because the plate’s thickness is only 1/100 of its length and width, you can simulate the process using a 2D approximation. The plate has a fixed temperature at one end and is isolated at the other. A surrounding liquid ... 詳細を見る
The example concerns a stainless-steel MEMS heat exchanger, which you can find in lab-on-a-chip devices in biotechnology and in microreactors such as for micro fuel cells. This model examines the heat exchanger in 3D, and it involves heat transfer through both convection and ... 詳細を見る
When simulating surface-to-surface radiation, we rely on the view factors between elements of diffuse surfaces that emit and receive radiation. To compute surface-to-surface radiation in a given geometry, operators are created by the heat interface and can be used to evaluate view ... 詳細を見る
The Highly Accelerated Stress Test (HAST) is a testing technique to precipitate failure of electronic devices under elevated temperature and high humidity environment. This model demonstrates the structural analysis of a plastic encapsulated IGBT module under the HAST testing condition. ... 詳細を見る
This model how to build and solve a conductive heat transfer problem using the Heat Transfer interface. The model, taken from a NAFEMS benchmark collection, shows an axisymmetric steady-state thermal analysis. As opposed to the NAFEMS benchmark model, we use the temperature unit kelvin ... 詳細を見る
The model demonstrates the basics of the 3-omega method. The coupled electromagnetic heating problem is solved in a solid sample which is heated by a thin copper strip, deposited on the surface of a sample. Analyzing the frequency dependence of the voltage oscillation amplitude, we ... 詳細を見る
