アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL アクセスアカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
This version of the balloon inflation example demonstrates how the Shell and Membrane interfaces can be used to model thin structures made of hyperelastic materials. The example is identical to the Model Library model 'Inflation of a spherical rubber balloon', except that the Membrane ... 詳細を見る
This is a full vibro-electroacoustic simulation of a balanced armature transducer (BAT or also known as a receiver in some industries) which is a high-performance miniature loudspeaker often used in hearing aids and other in-ear audio products such as earbuds. The model is set up and ... 詳細を見る
Anisotropic hyperelastic materials are used for modeling collagenous soft tissue in arterial walls. The Arterial Wall Mechanics application describes a section of an artery based on the Holzapfel–Gasser-Ogden hyperelastic material model. In this example the dynamic behavior of the artery ... 詳細を見る
This tutorial simulates a standard test and benchmark model for nonreflecting conditions and sponge layers for linearized Euler-like systems. It involves the propagation of a transient Gaussian pulse in a 2D uniform flow. The Convected Wave Equation, Time Explicit interface solves the ... 詳細を見る
This model analyzes the nonlinear transfer impedance of a tapered orifice that can be part of a perforate or microperforated plate (MPP). The analysis is carried out for various degrees of tapering of the perforate and for a frequency range. A linear analysis is set up in the frequency ... 詳細を見る
Interference fit is a technique used to join or fit one part over or around another part. The internal part is cooled, so that it shrinks, and is then fitted. Once the part heats up again and expands, a contact pressure builds up at the interface between the two parts. This type of ... 詳細を見る
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... 詳細を見る
When analyzing rotors, it is common that bearings are modeled through their effective dynamic coefficients about a static equilibrium position. This model illustrates how to compute such coefficients for a cylindrical journal bearing. The bearing length is kept much smaller than its ... 詳細を見る
This model describes a static stress analysis to obtain the stress distribution in the vicinity of a small hole in an infinite plate. The model is a classic benchmark and is described in Mechanics of Material, by D. Roylance. The stress level is then compared with the theoretical values. 詳細を見る
This example presents a homogenized model of a corrugated sheet based on a unit cell approach. The numerically obtained equivalent stiffness matrices are compared with various analytical models. Two corrugation profiles, trapezoidal and round, are considered in this example. 詳細を見る