アプリケーションギャラリ

This model studies a part of a shell-and-tube heat exchanger where hot water enters from above. The cooling medium flows through the tubes that, in this model, impose a constant temperature at the walls. Furthermore, the tubes are assumed to be made of stainless steel and the heat flux ... 詳細を見る

This tutorial shows how to use the Surface-to-Surface Radiation interface to simulate radiative heat transfer with radiation between diffuse emitters and diffuse-and-specular reflectors. This model is separated in two parts. The first part focuses on a validation test for the radiative ... 詳細を見る

このモデルは, 高レート充電中の角柱型電池の内部温度分布を計算する方法の例を示します. 電気化学は, 熱伝達モデルと結合した集中二電極モデルによって記述されます. 熱伝達モデルには, 集電体および端子におけるジュール熱の影響に加え, ゼリーロールにおける電気化学的加熱 (過電圧による) の寄与も考慮されています. ゼリーロールは, 電池層の構造と寸法を考慮した異方性特性を用いて記述されます. 詳細を見る

This example focuses on the species transport within the gas diffusion layers (GDLs) of a proton exchange membrane (PEM) fuel cell. The geometry models a cell with two adjacent flow channels of different pressures, a situation that may occur in a cell with serpentine flow channels, or in ... 詳細を見る

In this tutorial, a filter system for a diesel engine is modeled, including a soot layer development and oxidization. The build-up of the layer is held in check by both catalytic and non-catalytic reactions, where carbon is oxidized to carbon monoxide and carbon dioxide, which in turn ... 詳細を見る

This app demonstrates the following: Geometry parts and parameterized geometries Sending an email with a report when the computation is finished User-defined email server settings which is useful when running compiled standalone applications Options for setting different mesh sizes ... 詳細を見る

以下の例は, COMSOL Multiphysics において, 2つの流体相を含む流体構造相互作用をモデル化する手法を示しています. 任意のラグランジュ・オイラー法 (ALE 法) と二相流, フェーズフィールドアプリケーションを用いて, より重い流体が障害物にどのような動きを引き起こすかを示しています. 詳細を見る

As integrated circuit (IC) technology advances, with circuits becoming more powerful and compact, it is increasingly important to identify and prevent any cause of circuit failure. One particularly critical factor contributing to circuit failure is electromigration within the ... 詳細を見る

This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... 詳細を見る

This example model consists of a two-hot-arm thermal actuator made of polysilicon. The actuator is activated through thermal expansion. The temperature increase required to deform the arms, and thus displace the actuator, is obtained through Joule heating (resistive heating). The greater ... 詳細を見る