アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
This tutorial simulates the turn-off transient (reverse recovery) of a simple PIN diode with an inductive load, loosely based on the book "Fundamentals of Power Semiconductor Devices" by B. J. Baliga (p. 256, 2008 edition). Unlike the book, which assumes an initial constant current ramp ... 詳細を見る
This example shows how to compute thermally induced stresses in a turbine stator blade using the Thermal Stress, Solid interface. The conditions within gas turbines are extreme. The pressure can be as high as 40 bar, and the temperature more than 1000 K. Any new component must therefore ... 詳細を見る
This model computes the ion energy distribution function (IEDF) for a commercial capacitively coupled plasma reactor. The results show good agreement with experimental data. 詳細を見る
This tutorial model presents a study showing the transient negative mobility and the negative differential conductivity effects in xenon. The stationary and time dependent Boltzmann equation in the two-term approximation is used to compute the electron energy distribution function. ... 詳細を見る
This is a benchmark model for a plane stress problem. The accuracy of the computed stress concentration is evaluated, and a mesh convergence study is performed for different element types. 詳細を見る
This example of a dipole antenna array demonstrates a cost-effective analysis using the Boundary Element Method (BEM). When dealing with a large array made of metallic radiators, the Finite Element Method (FEM) would necessitate greater computational resources. The simulation results ... 詳細を見る
This model analyzes Joule heating and thermal expansion in a bond wire in an LED. Its purpose is to estimate the temperature increase and the resulting mechanical stresses in the bond wire due to thermal expansion. The magnitude of these stresses can be used to assess the risk of fatigue ... 詳細を見る
The Monte Carlo simulation of flow in a turbomolecular pump can be greatly simplified if the mean radius of the blades is much greater than the spacing between them. Under these conditions, the rotating blades of the pump can be approximated as an infinite row of blades having only ... 詳細を見る
Interfacial failure by delamination or debonding can be simulated with a Cohesive Zone Model (CZM). This example shows the implementation of a CZM with a bilinear traction-separation law. It is used to predict the mixed-mode softening onset and delamination propagation in a composite ... 詳細を見る
This simple model demonstrates how to use the Semiconductor Optoelectronics interfaces to model a simple GaAs PIN diode structure. Both the stimulated and spontaneous emission in the semiconductor are accounted for. The corresponding absorption of the light and the associated change in ... 詳細を見る
