アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL アクセスアカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
Thermal energy storage units are used to accumulate thermal energy from solar, geothermal, or waste heat sources. The simplest units are built from water tanks, often found in households, where the solar energy is stored as sensible heat. The thermal capacity of these tanks can be ... 詳細を見る
DC glow discharges in the low-pressure regime have long been used for gas lasers and fluorescent lamps. DC discharges are attractive to study because the solution is time independent. The 1D and 2D models show how to use the DC Discharge interface to set up an analysis of a positive ... 詳細を見る
Wave heated discharges may be very simple, where a plane wave is guided into a reactor using a waveguide, or very complicated as in the case with ECR (electron cyclotron resonance) reactors. In this example, a wave is launched into reactor and an Argon plasma is created. The wave is ... 詳細を見る
This tutorial models an ICP reactor by solving plasma fluid type equations fully coupled with the homogeneous and time-independent electron Boltzmann equation in the classical two-term approximation. The approximated Boltzmann equation is solved for each position of space and is coupled ... 詳細を見る
Streamers are transient filamentary electric discharges that can develop in a nonconducting background in the presence of an intense electric field. These discharges can attain high electron number density and consequently a high concentration of chemical active species that are relevant ... 詳細を見る
This tutorial shows how to use the Surface-to-Surface Radiation interface to simulate radiative heat transfer with radiation between diffuse emitters and diffuse-and-specular reflectors. This model is separated in two parts. The first part focuses on a validation test for the radiative ... 詳細を見る
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... 詳細を見る
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... 詳細を見る