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This tutorial model demonstrates the use of the multiphysics coupling feature Thermal Connection, Layered Shell, Surfaces. In this model, one layered shell is connected to heat domains by a facing boundary. The results obtained with the Heat Transfer in Shells interface are compared with ... 詳細を見る

This tutorial model demonstrates the use of the multiphysics coupling feature Thermal Connection, Layered Shell, Surfaces. In this model, three layered shells are connected to heat domains by interior and exterior boundaries. The results obtained with the Heat Transfer in Shells ... 詳細を見る

This example model consists of a two-hot-arm thermal actuator made of polysilicon. The actuator is activated through thermal expansion. The temperature increase required to deform the arms, and thus displace the actuator, is obtained through Joule heating (resistive heating). The greater ... 詳細を見る

This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library. The purpose of ... 詳細を見る

この例では, 積層板の熱応力について考察します. コーティング層と基板層の2層からなる板は, 800 ℃ では応力とひずみがゼロの状態です. 板の温度を 150 ℃ まで下げると, 熱膨張係数の差により熱応力が発生します. 次に, 応力がゼロの状態から3層目のキャリア層を積層します. 最後に温度を 20 ℃ まで下げると, すべての層に熱応力が発生します. 詳細を見る

This model demonstrates how to couple the Semiconductor interface to the Heat Transfer in Solids interface. A thermal analysis is performed on the existing bipolar transistor model in the case when the device is operated in the active-forward configuration. The Semiconductor interface ... 詳細を見る

この2ホットアーム熱アクチュエーターのチュートリアルモデルは, 電流伝導, 発熱を伴う熱伝導, そして熱膨張による構造応力とひずみという3つの異なる物理現象を連成します. このモデルには3つのバージョンがあります. マイクロアクチュエーターのジュール熱(thermal_actuator_jh.mph)：このモデルバージョンでは, 電流と温度のみが計算され, 変形は無視されます. COMSOL Multiphysicsライセンスのみが必要です. 熱アクチュエーター (thermal_actuator_tem.mph) ... 詳細を見る

This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach, the thin domains are modeled with thermal resistors in the Lumped Thermal System ... 詳細を見る

Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, ... 詳細を見る

Microwave filters are used to eliminate unwanted frequency components in the output from microwave transmitters. They are typically inserted between a power amplifier and an antenna. The amplifiers are nonlinear and produce harmonics that must be eliminated with filters that have a ... 詳細を見る