アプリケーションギャラリ

Journal bearings are used to carry radial loads, for example, to support a rotating shaft. A simple journal bearing consists of two rigid cylinders. The outer cylinder (bearing) wraps the inner rotating journal (shaft). The new thin-film flow user interfaces of the CFD Module enables ... 詳細を見る

This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the ... 詳細を見る

In this example, a torque is applied to the inner edge of a circular annulus-shaped membrane while the outer edge is fixed, resulting in membrane wrinkling. The wrinkling membrane model avoids the equilibrium instability that would be produced by the compressive stresses. The effect of ... 詳細を見る

This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library. The purpose of ... 詳細を見る

This model illustrates the dynamics of helical gears. It is built using the gears functionality in the Multibody Dynamics interface in COMSOL Multiphysics. A transient study is performed to analyze the effect of constant gear mesh stiffness, varying gear mesh stiffness, and the ... 詳細を見る

In this example, a benchmark problem in dynamic fracture of brittle materials is analyzed using the AT1 phase-field damage model. An instantaneous tensile load is applied to a planar tension specimen with a pre-existing crack. Initially, the crack propagates perpendicular to the loading ... 詳細を見る

This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... 詳細を見る

Using a Fluid-Solid Interaction multiphysics interface, the behavior of a spring-loaded ball check valve is studied under varying functional and reverse flow. The fluid force acting on the ball opens the valve at the opening pressure. In the case of a reversed pressure, the ball comes ... 詳細を見る

This model demonstrates how to compute satellite temperature over multiple orbit periods by coupling Orbital Thermal Loads to Heat Transfer in Solids. The direct solar, albedo, and Earth infrared thermal loads are computed over a single orbit, and are periodically repeated over multiple ... 詳細を見る

This is a model of an adapter for microwave propagation in the transition between a rectangular and an elliptical waveguide. Such waveguide adapters are designed to keep energy losses due to reflections at a minimum for the operating frequencies. To investigate the characteristics of the ... 詳細を見る