The Application Gallery features COMSOL Multiphysics tutorial and demo app files pertinent to the electrical, mechanical, fluid, and chemical disciplines. You can download ready-to-use tutorial models and demo apps with step-by-step instructions for how to create them yourself. The examples in the gallery serve as a great starting point for your own simulation work.

Use the Quick Search to find tutorials and apps relevant to your area of expertise. Log in or create a COMSOL Access account that is associated with a valid COMSOL license to download the MPH-files.

Kirsch Infinite Plate Problem

This model describes a static stress analysis to obtain the stress distribution in the vicinity of a small hole in an infinite plate. The model is a classic benchmark and is described in Mechanics of Material, by D. Roylance. The stress level is then compared with the theoretical values.

Rolling of a Rigid Wheel

The purpose of this model is to demonstrate pure rolling of a rigid wheel when given initial forward velocity together with lean about the forward direction. This is implemented through the Multibody dynamics module in COMSOL Multiphysics. The rolling motion of the wheel has been implemented without the use of contact.

Generalized Kelvin Viscoelastic Material

The behavior of viscoelastic materials can be represented by conceptual models composed of elastic and viscous elements connected in series or in parallel. The rheology of the generalized Kelvin model (also called generalized Kelvin-Voigt model) consists of an elastic spring to represent the instantaneous stiffness plus n Kelvin-Voigt branches connected in series. This example shows how to ...

Fatigue Failure of an Eyeglass Frame

In the search for weight reduction, the cross-section of an eyeglass frame is continuously reduced. The thin section over the nose transfers the entire load between the two halves. This example predicts the fatigue life using the combined Basquin and Coffin-Manson model when eyeglasses are subjected to bending.

Electrodeposition of a Microconnector Bump in 2D

This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal displays (LCDs) and driver chips. The location of the bumps on the electrode surface is controlled by the use ...

Slip Flow Benchmark

This model is a benchmark model for the Slip Flow interface. It is based on both analytic and numeric calculations. Air at atmospheric pressure flows through a conducting micro-channel connecting two reservoirs maintained at different temperatures. A flow between the two reservoirs develops as a result of thermal creep along the channel wall, which in turn produces a pressure gradient. At steady ...

Quarter-Wave Transformer

Transmission lines are used when the frequency of the electromagnetic signals is so high that the wave nature of the signals must be taken into account. A consequence of the wave nature is that the signals are reflected if there are abrupt changes of the characteristic impedance along the transmission line. Similarly, the load impedance, Z(L), at the end of the transmission line must match its ...

Electrical Heating in a Busbar

This tutorial model of the Joule heating effect in a busbar demonstrates how to synchronize an assembly between Creo Parametric and COMSOL, how to modify the geometry from COMSOL, and how to run a geometric parametric sweep.

Semibatch Polymerization

As reactant monomer converts into polymer chains, the density of the reacting mixture often changes notably. In this example you will look at how this effect impacts the total production of polymer in a process. The liquid phase polymerization takes place in a semibatch reactor, where two operating conditions are compared. In the first scenario, the feed of monomer to the reactor is turned off ...

Electrodeposition on a Resistive Patterned Wafer

This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated.