アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL アクセスアカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
Electronic equipment often has to be certified to function after having been subjected to a specified shock load. In this example, the effect of an 50g 11ms half sine shock on a circuit board is investigated using response spectrum analysis. The results are compared with a time domain ... 詳細を見る
Hydrogen embrittlement refers to the degradation of metal ductility due to the absorption of hydrogen. The metal becomes more brittle and thus cracks might initiate at lower stress levels. It is important to estimate hydrogen concentration and the speed at which it diffuses into the ... 詳細を見る
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... 詳細を見る
The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components ... 詳細を見る
In this tutorial, the vibrational behavior of a small aluminum plate with four waveguide structures is analyzed. This is an example of a structural component located in a device where elastic waves are propagating, like a smart speaker, an electric motor, or a MEMS device. The plate can ... 詳細を見る
This tutorial example shows how to perform a random vibration analysis of a structure using power spectral density (PSD). The computations are based on the modal reduced order model (ROM). 詳細を見る
A fuel cell stack operates at temperatures just below 100 °C, which means that it has to be heated at start-up. The fuel cell stack consists of unit cell of anode, membrane, and cathode connected in series through bipolar plates. This study presents a model that couples the thermal and ... 詳細を見る
Including circumferential displacements in a 2D axisymmetric Solid Mechanics interface allows to compute twist and bending deformations. This model determines stress concentration factors for a hollow shaft for load cases of axial extension, torsion, as well as bending, using a ... 詳細を見る
In this tutorial model, the flow in a pipe with a bend is computed using the Pipe Flow interface. The computed fluid load is used as input to a stress analysis in the Pipe Mechanics interface. Gravity loads from the pipe and fluid are also taken into account. 詳細を見る
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... 詳細を見る