Dipartimento di Ingegneria Industriale, Università di Parma, Parma, Italy
Simulated Thermal Response Test (TRT) data are analyzed in order to evaluate the effect of the tridimensionality model’s feature in determining the proper value of the soil thermal conductivity and borehole thermal resistance. The 3D system’s simulation during the TRT is realized by adopting the finite element method. The comparison of the numerical results with the analytical ...
Hyperbolic Heat Transfer Equation for Radiofrequency Heating: Comparison between Analytical and COMSOL Solutions
V. Romero-García, M. Trujillo, M.J. Rivera, J.A. López Molina, and E.J. Berjano
Centro de Tecnologías Físicas Acústica, Universidad Politécnica de Valencia, Valencia, Spain
Dpto. Matemática Aplicada, Instituto Universitario de Matemática Pura y Aplicada, Universidad Politécnica de Valencia, Valencia, Spain
Institute for Research and Innovation on Bioengineering, Universidad Politécnica de Valencia, Valencia, Spain
The Radiofrequency Heating (RFH) is widely employed to heat biological tissue in different surgical procedures. Most models analyze the RFH employing a Parabolic Heat Transfer Equation (PHTE) based on Fourier's theory. The PHTE can be used for problems involving long heating times or low thermal gradients. However, when the problem involves short heating times or extreme thermal gradients it is ...
V.M. Rodriguez-Zermeno, M.P. Sørensen, N.F. Pedersen, N. Mijatovic, and A.B. Abrahamsen
DTU Mathematics, Lyngby, Denmark
DTU Electrical Engineering, Lyngby, Denmark
Materials Research Division, Risø, DTU, Roskilde, Denmark
This work presents a method to calculate AC losses in thin conductors such as the commercially available second generation superconducting wires through a multiscale meshing technique. The main idea is to use large aspect ratio elements to accurately simulate thin material layers. For a single thin superconductor, several standard test cases are simulated including transport current, externally ...
G.S. Durante and M. Fretz
CSEM Zentralschweiz, Alpnach Dorf, Switzerland
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...
E. Gongadze, S. Petersen, U. Beck, and U. van Rienen
Institute of General Electrical Engineering, University of Rostock, Rostock, Germany
Institute of Electronic Appliances and Circuits, University of Rostock,
The Electrical Double Layer (EDL) plays a major role in understanding the interface between a charged surface (e.g. an implant) and ionic liquids (e.g. body fluids). The three classical models of the EDL (Helmholtz, Gouy, and Chapman-Stern) are numerically solved for a flat surface electrode in the 3D Electrostatics application mode of COMSOL Multiphysics® 3.5a. The values of the electric ...
P. Bonfiglio and F. Pompoli
Materiacustica S.r.l., Ferrara, Italy
Engineering Department, University of Ferrara, Ferrara, Italy
The present work deals with a numerical investigation of resonating systems used for noise control applications. In literature one can find analytical models based on fluiddynamics concepts for evaluating losses occurring across the holes of the perforates. In the paper an acoustical formulation based on the equivalent dissipative fluid approach will be analyzed. It will be firstly applied to ...
T. Graf, O. Schälli, A. Furrer, and P. Marty
Technik und Architektur, Hochschule Luzern, Horw, Switzerland
This paper analyzes the magnetic behavior of electroplated wires. For this purpose the resistance and inductance of single turn loops and coils have been simulated and measured. The measurement is delicate due to the influence of a stray capacitance. We show that the quality factor of magnetic plated loops and coils can be tuned easily by the plating thickness. In addition the quality factor of ...
C. Caruso, P. Lonetti, and A. Manna
Department of Structural Engineering, University of Calabria, Arcavacata di Rende, CS, Italy
A generalized model to predict dynamic crack propagation in fiber composite structures is proposed. The proposed approach is based on a generalized formulation based on the Fracture Mechanics approach and Moving mesh methodology. Consistently to the Fracture Mechanics, the crack propagation depends from the energy release rate and its mode components, which are calculated by means of the ...
U. Bardi, C. Borri, A. Fossati, A. Lavacchi, and I. Perissi
Dipartimento di Chimica, Università degli Studi di Firenze, Sesto Fiorentino, FI, Italy
A Finite element model of plasma sprayed TBC’s was developed to estimate the stress induced by thermal cycling experiments. A heat transfer analysis was performed to evaluate the temperature distribution on the specimen during the cooling under an impinging air jet; temperature measurements performed with an infrared pyrometer on the cooled samples show good agreement with the evaluated ...
J. Hrdlicka, P. Cervenka, M. Pribyl, and D. Snita
Department of Chemical Engineering, Institute of Chemical Technology Prague, Prague, Czech Republic
In this paper we present results of the mathematical modeling of AC electroosmotic micropumps. Unlike others we use the full dynamic description, instead of the linearized model. Skewed hybrid discretization meshes are employed in order to accurately capture the main features of the studied system. Also, we introduce zig-zag electrode arrangements for traveling-wave electroosmotic micropumps. The ...