Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

FEM-Simulation of a Printed Acceleration Sensor with RF Readout Circuit

H. Schweiger[1], T. Göstenkors[1], R. Bau[1], D. Zielke[1]
[1]Dept. Engineering Sciences and Mathematics, University of Applied Sciences Bielefeld, Bielefeld, Germany

In this paper we want to figure out the development of a capacitive acceleration-sensor system with the FEM-Method. The sensor-system is in the position to detect accelerations in the range of ±20 g. Furthermore the sensor-element contains a printed RF-inductance, which is used for contactless data transfer. On the one hand the simulation of the L-C-oscillating circuit using the RF Module of ...

Optimization and Simulation of MEMS Based Thermal Sensor for Performance of Transformer Oil

V. Vijayalakshmi[1], K. C. Devi[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

In this work, a bimetallic strip based thermal sensor was designed using MEMS module of COMSOL Multiphysics® software to monitor the temperature rise in insulating oil which was used as coolant in transformers. The bimetallic strip was designed with different shapes such as cylindrical, rectangle, square & conical and different compositions such as Al/Steel Alloy and Fe/Cu which can withstand ...

Mathematical Modeling of Zig-Zag Traveling-Wave Electro-Osmotic Micropumps

J. Hrdlicka[1], P. Cervenka[1], M. Pribyl[1], and D. Snita[1]
[1]Department of Chemical Engineering, Institute of Chemical Technology Prague, Prague, Czech Republic

In this paper we present results of the mathematical modeling of AC electroosmotic micropumps. Unlike others we use the full dynamic description, instead of the linearized model. Skewed hybrid discretization meshes are employed in order to accurately capture the main features of the studied system. Also, we introduce zig-zag electrode arrangements for traveling-wave electroosmotic micropumps. ...

Simulation of MEMS Based Pressure Sensor for Diagnosing Sleep Disorders

J. Vijitha[1], S. S. Priya[1], K. C. Devi[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

Sleep apnea is a type of sleep disorder characterized by pauses in breathing or instances of shallow or infrequent breathing during sleep. There is a need to diagnose sleep apnea since it leads to fluctuations in the oxygen level that in turn affect the heart rate and blood pressure. In order to detect this disorder, a Micro Electro Mechanical System (MEMS) based piezoelectric pressure sensor ...

Reliability Enhancement of Bio MEMS based Cantilever Array Sensors for Antigen Detection System using Heterogeneous Modular Redundancy

L. S. Sundharam[1]
[1]Kumaraguru college of Technology, Coimbatore, Tamil nadu, India

The objective of the work is to propose a reliability enhancement model for antigen detection system (ADS) using bio MEMS based cantilever array sensors using heterogeneous modular redundancy technique. The reliability of the ADS is expressed in terms of the constituent sub systems which are heterogeneous not only in their respective structures and behaviors but also in their forms. The possible ...

Numerical and Experimental Evaluation for Measurement of a Single Red Blood Cell Deformability Using a Microchannel and Electric Sensors

K. Tatsumi[1]
[1]Kyoto University, Kyoto City, Kyoto, Japan

An electric micro-resistance sensor that can continuously measure the deformability of a single red blood cell (RBC) in a microchannel and a numerical model that can simulate the resistance and capacitance of the cell membrane and cytoplasm are developed and improved. The resistance signal pattern between the electrodes is measured to evaluate the feasibility of the present sensor, using the ...

Numerical Investigation of Electroosmotic Flow in Convergent Divergent Micronozzle

V. Gnanaraj[1], V. Mohan[1], and B. Vellaikannan[1]
[1]Thiagarajar College of Engineering, Madurai, Tamilnadu, India

A fundamental understanding of the transport phenomena in microfluidic channels is critical for systematic design and precise control of such miniaturized devices towards the integration and automation of Lab-on- a-chip devices. Electroosmotic flow is widely used to transport and mix fluids in microfluidic systems. Electroosmotic transport in convergent divergent micronozzle is significant in ...

A Consistent Environment for the Numerical Prediction of the Properties of Composite Materials

J. Schumacher[1], P. Fideu[2], G. Ziegmann[1], and A. Herrmann[3]
[1]TU Clausthal-Institute of Polymere Materials and Plastic Engineering, Clausthal-Zellerfeld, Germany
[2]CTC GmbH Stade, Stade, Germany
[3]Faserinstitut Bremen e.V., Bremen, Germany

The current paper focuses on the creation of a consistent environment for the numerical prediction of the physical properties of polymer composite. A limitation factor for the successful simulation of composite processes is the correct estimation of the effective properties depending on several factors such as the constituents (fiber, polymer), the process setup. The numerical prediction of the ...

Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics

M. Guvench[1], and J. Crosby[1]
[1]University of Southern Maine, Gorham, Maine, USA

In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of electrical power to displacement force is thermal expansion. A slim beam of MEMS material, typically Silicon, is heated by the application of electrical current via Joule heating; it expands and creates motion. In the design of many MEMS devices ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.