Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Dynamic Multi-Phase Modelling and Optimisation of Fluid Jet Polishing Process

A. Beaucamp[2], R. Freeman[2], and Y. Namba[1]
[1]Chubu University, Kasugai, Japan
[2]Zeeko Ltd, Coalville, UK

In the Fluid Jet Method, a polishing fluid is compressed and delivered through a nozzle, allowing the spot area to become continuously replenished with abrasives and coolant. Process parameters include: Abrasive type and concentration, Inlet pressure, Nozzle diameter, Impingement angle, Surface feed of spot. The simulation uses COMSOL’s turbulent 2-phase flow model, with the incompressible ...

Topology Optimization of Dielectric Metamaterials Based on the Level Set Method Using COMSOL Multiphysics

M. Otomori, and S. Nishiwaki
Kyoto University

This presentation shows a level set-based topology optimization method for the structural design of negative permeability dielectric metamaterials incorporating the level set boundary expression based on the concept of the phase field method, and its optimization algorithm implemented by COMSOL Multiphysics. Furthermore, several design examples are provided to confi rm the usefulness of the ...

Acoustic Streaming of a Sharp Edge

M. Ovchinnikov[1]
[1]Alcon Research Ltd., Lake Forest, CA, USA

Anomalous acoustic streaming is observed from sharp edges of vibrating solid bodies in fluids. The streaming velocities can be orders of magnitude higher than expected from the Rayleigh streaming at similar amplitudes of vibrations. Acoustic velocity of a fluid relative to a solid body diverges at a sharp edge giving rise to a localized time-independent body force acting on the fluid. The ...

Numerical Modeling of Power Reactors' Fuel Bundles

R. Schmidt[1], T. Yousefi[2], B. Farahbaksh[2], M. Z. Saghir[2]
[1]University of Louisiana at Lafayette, Lafayette, LA, USA
[2]Ryerson University, Toronto, ON, Canada

Fuel bundles in the CANDU (CANada Deuterium Uranium) reactor are designed for heating a pressurized coolant (heavy water) to generate electricity. The designs for the fuel bundles differ based on the number of heating elements. The flow of heavy water over the elements and inside the shell is highly turbulent. In this paper, COMSOL Multiphysics® is used to simulate the heavy water flow ...

Modelling the Response of Microdialysis Probes in Glucose Concentration Measurement

J.M. Gozálvez-Zafrilla[1], A. Santafé-Moros[1], J.L. Díez-Ruano[2], J. Bondia[2]
[1]Institute for Industrial, Radiophysical and Environmental Safety (ISIRYM) - Universitat Politècnica de Valencia, Valencia, Spain
[2]Instituto Universitario de Automática e Informática Industrial (AI2) - Universitat Politècnica de Valencia, Valencia, Spain

Microdialysis is a technique of continuous glucose monitoring in diabetic patients. In microdialysis, a saline serum is perfused into a microdialysis probe. Glucose pass from the plasmatic fluid through the porous membrane. The glucose concentration in the dialysate obtained is measured by an external analytical device. This preliminary work aimed to obtain a model to relate glucose ...

Simulation of a Single-Sided Magnetic Particle Imaging Device with COMSOL Multiphysics®

K. Gräfe[1], J. Mrongowius[1], T.M. Buzug[1]
[1]Institute of Medical Engineering, University of Luebeck, Germany

For the MPI imaging process, superparamagnetic iron oxide nanoparticles (SPIONs) are used as tracer material. The particles are excited by a sinusoidally varying magnetic field. A field-free point (FFP) is generated by the superposition of two magnetic fields. The FFP is important for the imaging process, since only the SPIONs in the FFP and its direct neighbourhood are essential for the ...

Temperature Measurements of a Single Gold Nanoparticle under Laser Illumination

Kenji SETOURA et al.[1]

[1]The University of Tokushima, Tokushima, Tokushima, Japan

Temperature measurement of nanoparticles (NPs) under heating is an important technique in order to achieve potential applications such as photothermal cancer therapy and nanofabrication. We implemented the method to estimate the local temperature of a laser-heated gold NP on glass substrate in various surrounding media by applying the light scattering spectroscopy. We discuss experimental ...

The Effect of Space Charge due to the Auto-Ionization of Neutral, Hydrogenic States in Point-Contact Germanium Detectors at MilliKelvin Temperatures - new

D. Faiez[1], N. Mirabolfathi[1], B. Sadoulet[1], K. M. Sundqvist[2]
[1]Department of Physics, University of California - Berkeley, Berkeley, CA, USA
[2]Department of Electrical & Computer Engineering, Texas A&M University, College Station, TX, USA

A class of semiconducting detectors, operated at temperature T~50mK, has direct application to the search for dark matter particle, when are able to simultaneously measure both the ionization and phonons created by particle interactions. We explore the effect of space charge accumulation in a germanium p-type point contact detector which arises due to the auto-ionization of hydrogenic ...

Finite Element Simulations of Pulsed Thermography Applied to Porous Carbon Fibre Reinforced Polymers - new

G. Mayr[1], B. Plank[1], J. Suchan[1], G. Hendorfer[1]
[1]University of Applied Sciences, Wels, Austria

Porosity in carbon fiber reinforced polymers (CFRP) as shown in figure 1 degrades the engineering performance, especially the interlaminar shear strength [1]. In the aviation industry a porosity level of 2.5 % has become the maximum level of acceptance. The presence of air-filled voids (pores) has strong effects on the thermal diffusivity. Pulsed thermography offers a rapid, non-destructive ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

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