研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL Conference 2024 論文集を見る
Because of its high enthalpy of combustion, aluminum has been added to energetic materials. In this paper, a two dimension thermal model is developed and assessed to describe the interrelated processes of Aluminum particle oxidation by using the software COMSOL Multiphysics. The thermal ... 詳細を見る
Testing and verification is very important to increase reliability of a system. In water analysis its purity is verified using different test methods. Biosensors are very useful to detect the microorganisms present in water. This paper presents a method to detect E.coli bacteria in water ... 詳細を見る
The 3D unit cell model approach offers an efficient tool to analyze the influences of geometrical design (channel shape and arrangement, filter length, wall thickness) and filter material properties (permeability, soot loading characteristics) on the performance of ceramic particle ... 詳細を見る
Microchannel heat sinks designed for applications in electronic cooling and having microscale heat transfer combine the attributes of high material compatibility, high surface area per unit volume ratios, and large potential heat transfer performance with a highly sophisticated and ... 詳細を見る
Dr. R. N Singh is currently a INSA Senior Scientist. Prior to this appointment, he was a CSIR Emeritus Scientist at the National Geophysical Research Institute (NGRI), Hyderabad. He has been the Scientist-in-Charge of CSIR Centre of Mathematical Modeling and Computer Simulation, ... 詳細を見る
A compression driver is a certain type of electrodynamic loudspeaker which has a phase plug with slits in front of the diaphragm. The slits are narrow enough that the so-called viscothermal effects are of significant importance. In this paper a 2D axisymmetric finite element model of a ... 詳細を見る
Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have ... 詳細を見る
As a part of a lab-on-chip-device, more often it is required to measure dielectric constant of the fluid. For this purpose it is necessary to develop a sensor whose size is compatible with microfluidic channel. The work, presented in this paper, studies effect of the parameters ... 詳細を見る
Underground coal gasification (UCG) has received renewed interest due to its potential for utilization of the vast amounts of coals available in deep underground seams and the current drive towards clean coal utilization. UCG process involves the reaction between air/steam and coal in ... 詳細を見る
In this session, we will discuss and showcase a few examples of advanced acoustics applications. In this context, “advanced” means problems that cannot simply be modeled “out-of-the-box,” but require the flexibility and strengths of COMSOL Multiphysics® software. Topics include: • ... 詳細を見る
