研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL Conference 2024 論文集を見る
As a part of a lab-on-chip-device, more often it is required to measure dielectric constant of the fluid. For this purpose it is necessary to develop a sensor whose size is compatible with microfluidic channel. The work, presented in this paper, studies effect of the parameters ... 詳細を見る
Underground coal gasification (UCG) has received renewed interest due to its potential for utilization of the vast amounts of coals available in deep underground seams and the current drive towards clean coal utilization. UCG process involves the reaction between air/steam and coal in ... 詳細を見る
In the Collaborative Research Centre 692 at TU Chemnitz several academic institutions work on aluminum matrix composites (AMCs). These materials consist of an aluminum matrix, which is reinforced by SiC or Al2O3 particles with dimensions less or equal 1 µm. One main task is finishing ... 詳細を見る
Dr. R. N Singh is currently a INSA Senior Scientist. Prior to this appointment, he was a CSIR Emeritus Scientist at the National Geophysical Research Institute (NGRI), Hyderabad. He has been the Scientist-in-Charge of CSIR Centre of Mathematical Modeling and Computer Simulation, ... 詳細を見る
Electroplating is a vital technology widely employed for many technological applications ranging from decorative or anti-corrosion coatings to high precision nanotechnology passive electromagnetic cloaking devices. This 2D Axisymmetric Electroplating Model demonstrates one of the ... 詳細を見る
We present a novel multi-layered electrode fabrication technique for polymer electrolyte membrane fuel cells (PEMFCs). This method consists of alternate layers of Pt deposition (0.05 mg/cm²) by sputtering on the painted multi-walled carbon-Nafion layer (CNL) with larger concentration of ... 詳細を見る
Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have ... 詳細を見る
The finite element method applied to the k-epsilon turbulence model is used to investigate the two-stream turbulent mixing layer. Whereas the model is known as one of the most popular of the turbulence models to date, the model has yet to be applied to the classical mixing layer problem ... 詳細を見る
The use of microwaves for heating purposes of dielectric materials is encountered in many industrial applications (food processing, chemistry, material engineering and medical applications). In most of these thermal applications, the prediction of the temperature evolution within the ... 詳細を見る
For the numerical solving of the equations, Comsol has been applied. Simulations have been modeled in 2D Cartesian, in cylindrical coordinate system and in a “mantle-like” cylindrical-shell. Mantle dynamics is controlled by the Rayleigh number (Ra), which is the ratio of the buoyancy ... 詳細を見る
