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This 3D model example demonstrates the use of the Lead-Acid Battery interface for modeling current distribution in full cell employing a lead-acid battery chemistry. The lead acid battery chemistry uses PbO2 as the positive porous electrode and Pb as the negative porous electrode and ... 詳細を見る
A cylindrical magnet falling through a copper tube induces eddy currents on the tube walls, which in turn, create a magnetic field that opposes the magnetic field of the magnet and induces a braking force that opposes the motion of the magnet. This model computes the velocity of the ... 詳細を見る
Copper electrowinning is the process of copper extraction from an electrolyte solution and its deposition at the cathode surface, by passing an external current through the electrolytic cell and using an insoluble anode. During the process, oxygen bubbles are generated at the anode ... 詳細を見る
In this time-dependent model, a silica block of glass, coated with a thin copper layer is subjected to a heat flux. Copper is a highly conductive material, while the silica glass is of poor thermal conductivity, which sets up an highly-varied temperature differential. The model must ... 詳細を見る
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... 詳細を見る
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... 詳細を見る
The induced currents in a copper cylinder produce heat that in turn change the electrical conductivity. This means that the field propagation has to be solved simultaneously with the heat transfer through the cylinder and surrounding system. This model shows this coupling between eddy ... 詳細を見る
This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track ... 詳細を見る
Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions ... 詳細を見る
