Copper Electroless Deposition

Application ID: 19863


Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper.

In electroless deposition, partial oxidation and reduction reactions occur at the same electrode surface. The potential difference that exists between the equilibrium potentials for oxidation and reduction reactions and the potential at the electrode surface is the driving force for deposition process.

This tutorial predicts the change in current density, deposition thickness and concentration of ionic species during electroless deposition.

This model example illustrates applications of this type that would nominally be built using the following products: