アプリケーションギャラリ

Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, ... 詳細を見る

During the design of a building, environmental issues have gained considerable influence in the entire project. One of the first concerns is to improve thermal performances. In this process, simulation software are key tools to model thermal losses and performances in the building. The ... 詳細を見る

The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components ... 詳細を見る

Double-pipe heat exchangers, with their typical U-turn shape, are one of the simplest and cheapest type of heat exchangers used in the chemical process industry. This example studies the cooling of hot oil (130°C) by a cool oil (60°C) entering in counter-current. As the oils flow ... 詳細を見る

This example shows how to compute thermally induced stresses in a turbine stator blade using the Thermal Stress, Solid interface. The conditions within gas turbines are extreme. The pressure can be as high as 40 bar, and the temperature more than 1000 K. Any new component must therefore ... 詳細を見る

This example studies heat transfer in a composite two-dimensional structure. Four materials with distinct thermal conductivities k compose the structure. The top and bottom boundaries are facing environments respectively at 0°C and 20°C. The temperature distribution and the heat flux ... 詳細を見る

This model studies the heat conduction in a thermal bridge made up of an iron bar and an insulation layer that separates a hot internal side from a cold external side. The heat flux between internal and external side and the maximum temperature on the external wall are compared them with ... 詳細を見る

This model treats the free convection of argon gas within a light bulb. It shows the coupling of heat transport (conduction, radiation and convection) to momentum transport (non-isothermal flow) induced by density variations caused by temperature. COMSOL Multiphysics model makes it ... 詳細を見る

This app demonstrates the following: Geometry parts and parameterized geometries Sending an email with a report when the computation is finished User-defined email server settings which is useful when running compiled standalone applications Options for setting different mesh sizes ... 詳細を見る

流体ダンパーは, 軍事機器における衝撃吸収, 土木構造物における地震や風による振動の抑制など, 様々な用途に使用されています. 流体ダンパーは, 機械エネルギーを熱に変換することで機能します. このモデルは, 流体ダンパーにおける粘性加熱とそれに伴う温度上昇の現象を示します. 粘性加熱はマイクロ流体デバイスにおいても重要です. マイクロ流体デバイスでは, 断面積が小さく長さが長いため, 大きな発熱が発生し, 結果として流体の流れに影響を与える可能性があります. このモデルでは, 共役熱伝達, 層流, 移動メッシュの各インターフェースを用いて時間依存スタディを実施します. 詳細を見る