アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL アクセスアカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
This model simulates the shape evolution of a microconnector bump over time as copper deposits on an electrode surface. Transport of cupric ions in the electrolyte occurs by convection and diffusion. The electrode kinetics are described by a concentration dependent Butler-Volmer ... 詳細を見る
At the macroscopic level, systems usually mix fluids using mechanical actuators or turbulent 3D flow. At the microscale level, however, neither of these approaches is practical or even possible. This model demonstrates the mixing of fluids using laminar-layered flow in a MEMS mixer. This ... 詳細を見る
This example studies the stationary state of free convection in a cavity filled with water and bounded by two vertical plates. To generate the buoyancy flow, the plates are heated at different temperatures, bringing the regime close to the transition between laminar and turbulent. To ... 詳細を見る
この例は, 指定された外部 (周囲) 温度への対流を含む 2D 定常熱解析を示しています. これはベンチマーク例として示されています. 目標位置のベンチマーク結果は 18.25 C です. COMSOL Multiphysics モデルでは, 556 要素のデフォルトメッシュを使用して, 温度は 18.28 C となります. その後, 均一なメッシュ細分化を繰り返していくと, 温度は 18.26 C と18.25 C となり, ベンチマーク結果に収束します. 詳細を見る
In friction stir welding, a rotating tool moves along the weld joint and melts the aluminum through the generation of friction heat. The tool’s rotation stirs the melted aluminum such that the two plates are joined. In this model, two aluminum plates are joined by generating friction ... 詳細を見る
This example demonstrates how to model phase transition by a moving boundary interface according to the Stefan problem. A square cavity containing both solid and liquid tin is submitted to a temperature difference between left and right boundaries. Fluid and solid parts are solved in ... 詳細を見る
Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, ... 詳細を見る
The heat distribution in a hollow pipe, whose ends are held at two different temperatures, is studied. The outside surface is assumed to be thermally isolated and the inner surfaces have radiation boundary conditions. The role of convection in the heat transfer is taken to be ... 詳細を見る
Density variations can initiate flow even in a still fluid. In earth systems, density variations can arise from naturally occurring salts, subsurface temperature changes, or migrating pollution. This buoyant or density-driven flow factors into fluid movement in salt-lake systems, saline ... 詳細を見る
This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal ... 詳細を見る
