研究開発におけるマルチフィジックスシミュレーションの具体例

さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.


COMSOL コンファレンス 2020 論文集を見る

MEMS and Nanotechnologyx

Analytical, COMSOL Simulation Optimization Of Vibration-Based Energy Harvesters For EV Applications new

Chandan Pandey1, Barun Pratiher1
1Indian Institute of Technology Jodhpur Rajasthan India 342037

Vibration-based Piezoelectric Energy harvesters convert ambient vibration energy into an applicable electrical charge for wireless sensors, IoT applications, and charging the battery, which is most important to range improvement of the Electric Vehicle. This study analyses different ... 詳細を見る

FEM-based Electrical Analysis of 3D-MOSFET new

Rishikesh Datar1, Amogh Patwardhan1, Shreyas Deshpande1, Gautam Bacher1
1Department of Electrical and Electronics Engineering, BITS Pilani K K Birla Goa Campus, Goa - 403726, India.

The fundamental and essential component of the semiconductor electronics industry is the Metal Oxide Semiconductor Field Effect Transistor (MOSFET). The 2D model of MOSFET is widely reported and available in the application library of COMSOL Multiphysics®. However, the 3D model of MOSFET ... 詳細を見る

Single membrane MEMS-based acoustic emission sensor for multi-frequency detection new

Durgesh Tamhane1, Saurabh Arun Chandorkar1
1Indian Institute of Science

Acoustic emissions generated by active defects in structures, like bridges, aircraft, and pipelines, play a crucial role in detecting flaws in their structural integrity by non-destructive evaluation techniques. Commercially used acoustic emission (AE) sensors are made of piezoelectric ... 詳細を見る

Reliability and Temperature Testing of PVDF-based Piezoelectric Energy harvesters. new

Chandana Ravikumar1, Vytautas Markevicius1
1Kaunas University of Technology, Lithuania (Europe)

During usage, storage, and transportation, electronic products often become affected by a few unwanted adverse effects of the surrounding environment that compromise their working performance, reliability, and device life. There is evidence that environmental effects cause 52% of such ... 詳細を見る

Wire Bonding: A Thorough Numerical Methodology

Beatrice Carasi1, Lucrezia Guarino1, Lucia Zullino1, Luca Cecchetto1
1STMicroelectronics

The semiconductor industry is always looking for early anticipation of manufacturing risk, pushing the development of Computer Aided Engineering (CAE) modeling of processes. Robust Chip-Package Interaction requires a deep understanding of thermo-mechanical stresses imposed during the ... 詳細を見る

Fully-Coupled Transient Modeling of a Highly Miniaturized Electrostatic Pull-In Driven Micropump

Wolfgang Hölzl1, Martin Seidl1, Gabriele Schrag1
1Technical University of Munich, Munich, Germany

We present a problem-adapted finite element model, which enables the design of a novel type of a highly miniaturized, electrostatic MEMS membrane pump, as well as the investigation and the optimization of its operation. The electro-mechanical actuation scheme constitutes a strongly ... 詳細を見る

Multiphysics Inertial Particle Focusing (IFP) Model Validated for 3D Microfluidic Geometries

G. Spinola Durante1, D. Bayat1
1CSEM SA (CH)

Inertial focusing of particles in a fluid flow is a physical effect induced by inertial forces already happening at the micro-fluidic scale. COMSOL Multiphysics® has provided an implementation of the drag and lift forces to compute this effect for a constant parallel-wall fluid channel ... 詳細を見る

Thermo-Electrical Improvement of a MEMS-IR-Emitter Membrane

Toni Schildhauer1, Andreas T. Winzer1
1CiS Forschungsinstitut für Mikrosensorik GmbH, Erfurt, Germany

NDIR (Non-dispersive infrared) sensors are state of the art for measuring gas concentrations in the Mid-infrared spectrum, e.g. components of exhaled human breath. These sensors require fitting light sources. Micro light bulbs and other filament based light source are sensible to ... 詳細を見る

Predictive Simulations of Warpage Phenomena on Arbitrarily Patterned Silicon Wafers

Filippo Sabatini1
1Politecnico di Milano, ST Microelectronics

In this simulation, we aim to comprehend the origin and mechanism of the warpage phenomenon in patterned silicon wafers, which are key components in the field of microelectronics. This issue can become more pronounced in the presence of high global density of the patterns and can lead to ... 詳細を見る

Acoustic-Mechanic Modeling of Polydimethylsiloxane in the MHz Regime for Metamaterials Applications

Lucrezia Maini1, Prof. Christofer Hierold1, Dr. Cosmin Roman1
1Micro- and Nanosystems, ETH Zurich, 8092, Zurich, Switzerland

Polydimethylsiloxane (PDMS) is a biocompatible material widely used in biomedical applications such as implantable sensors. A realistic modeling of PDMS in acoustic-mechanic simulation is useful especially for medical applications which use ultrasonic waves as interrogation source. ... 詳細を見る

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