Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Efficient Generation of Surface Plasmon Polaritons with Asymmetric Nano-structures

J. Chen
Peking University

This paper covers the following: * All-Optical Light Modulation of surface plasmon polaritons (SPPs) is achieved using asymmetric single nanoslits. A high on/off switching ratio of >20 dB and phase variation of >? were observed with the device lateral dimension of only about 2 ?m. * Efficient unidirectional excitation of SPP as well as beam splitting are achieved using the dielectric–film ...

Single Crystal Diamond NEMS Switch

M. Liao
Optical and Electronic Materials Unit
National Institute for Materials Science

A single-crystal diamond NEMS switch was fabricated while batch production of SCD MEMS/NEMS structures were developed. The diamond NEMS switches exhibit high performance with respect to high controllability, high reproducibility, and good reliability. Modeling and simulations were made that were consistent with experiments.

Study of Fluid Dynamics and Heat Transfer in MEMS Structures

S. N. Das[1], G. Bose[2]
[1]Centurion University of Technology and Managment, Jatani, Bhubaneswar, Orissa, India
[2]Institute of Technical Education and Research, SOA University, Bhubaneswar, Orissa, India

This paper describes the characteristics of MEMS microchannel and various issues of its designing. Here the major parameters are pressure drop and heat transfer rate. Various structures are modeled and optimized to get a minimum pressure drop and maximum heat transfer rate. The simulation results provide the characterization for Temperature, Mass flow rate, Pressure drop and Reynolds number. ...

Empirical Model Dedicated to the Sensitivity Study of Acoustic Hydrogen Gas Sensors Using COMSOL Multiphysics®

A. Ndieguene[1], I. Kerroum[1], F. Domingue[1], A. Reinhardt[2]
[1]Laboratoire des Microsystèmes et de Télécommunications/Université du Québec à Trois-Rivières, Trois-Rivières, QC, Canada
[2]Laboratoire d’Électronique et des Technologies de l’Information, CEA, LETI Grenoble, France

Due to the increasing demand for hydrogen gas sensors for applications such as automation, transportation, or environmental monitoring, the need for sensitive and reliable sensors with a short response time is increasing. This paper presents an empirical model that studies the sensitivity of acoustic hydrogen gas sensors. A parametric study based on the variation of physical properties of ...

Design and Simulation of MEMS-based Piezoelectric Accelerometer

Siram Sai Krishna[1], Nuti Venkata Subrahmanya Ayyappa Sai[1], Dr.K.Srinivasa Rao[2]
[1]Lakireddy Bali Reddy College of Engineering, Mylavaram, Andhra Pradesh, India
[2]Professor & HOD, Dept. of Electronics and Instrumentation Engineering, Lakireddy Bali Reddy College of Engineering, Mylavaram, Andhra Pradesh, India

The Micro electro mechanical systems (MEMS) technology provides us a platform to interface between mechanical and electrical components. In this paper, we have designed MEMS accelerometer based on piezoelectric property, and simulated using COMSOL Multiphysics®. The design, which has PZT kept in the annular diaphragm, provides good sensitivity. When this accelerometer is subjected to stress ...

Simulations of Micropumps Based on Tilted Flexible Structures - new

M. J. Hancock[1], N. H. Elabbasi[1], M. C. Demirel[2]
[1]Veryst Engineering, LLC., Needham, MA, USA
[2]Pennsylvania State University, University Park, PA, USA

Pumping liquids at small scales is challenging because of the principle of reversibility: in a viscous regime, the flow streamlines through a fixed geometry are the same regardless of flow direction. Recently we developed a class of microfluidic pump designs based on tilted flexible structures that combines the concepts of cilia (flexible elastic elements) and rectifiers (e.g., Tesla pump). We ...

Simple Finite Element Model of the Topografiner - new

H. Cabrera[1], D. A. Zanin[1], L. G. De Pietro[1], A. Vindigni[1], U. Ramsperger[1], D. Pescia[1]
[1]Laboratory for Solid State Physics, ETH Zürich, Zürich, Switzerland

In our recent experiments we are revisiting the topografiner technology for the imaging of surface topography with a resolution of a few nanometers. In these new technique called Near-Field Emission Scanning Electron Microscopy (NFESEM), low-energy electrons are emitted from a polycrystalline tungsten tip via electric-field assisted tunneling. In order to characterize and improve the ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics

M. Guvench[1], and J. Crosby[1]
[1]University of Southern Maine, Gorham, Maine, USA

In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of electrical power to displacement force is thermal expansion. A slim beam of MEMS material, typically Silicon, is heated by the application of electrical current via Joule heating; it expands and creates motion. In the design of many MEMS devices ...

Robust and Reliability-based Design Optimization of Electromagnetic Actuators Using Heterogeneous Modeling with COMSOL Multiphysics and Dynamic Network Models

H. Neubert[1], A. Kamusella[1], and T-Q. Pham[2]
[1]Technische Universität Dresden, Germany
[2]OptiY e. K. Aschaffenburg, Germany

For an exemplary electromagnetic actuator used to drive a Braille printer, a design optimization was performed. The optimization involves stochastic variables and comprises nominal optimization, robustness analysis and robust design optimization. A heterogeneous model simulates the static and the dynamic behavior of the actuator and its non-linear load. It consists of a network model in ...