Thermal Initial Stresses in a Layered Plate

Application ID: 273


The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced. A third layer, the carrier layer, is added and the thermal stresses in the coating and a substrate layer are added as an initial stress and the temperature is finally reduced to 20 degrees C.

This model example illustrates applications of this type that would nominally be built using the following products:

MEMSモジュール 構造力学モジュール