アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL アクセスアカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... 詳細を見る
In this example, a benchmark problem in dynamic fracture of brittle materials is analyzed using the AT1 phase-field damage model. An instantaneous tensile load is applied to a planar tension specimen with a pre-existing crack. Initially, the crack propagates perpendicular to the loading ... 詳細を見る
Micromirrors are used in certain MEMS devices to control optic elements. This model of a vibrating micromirror surrounded by air uses the Thermoacoustic-Shell Interaction user interface to model the fluid-solid interaction, and it thus includes the correct viscous and thermal damping of ... 詳細を見る
This model demonstrates the inflation of a rubber balloon with four different hyperelastic material models. The results are compared with the analytical solution for a thin-walled, spherical vessel. Controlling the inflation of hyperelastic balloons is important in clinical ... 詳細を見る
Layered shell elements, which are used for modeling composite shells, often connected to solid and shell elements in cladding or side-by-side configuration to represent a realistic structure. For such applications, it becomes important to connect layered shell element correctly and ... 詳細を見る
This model shows how to use the scattered field formulation to compute the transmission coefficient for impinging P and S plane elastic waves onto a finite size phononic crystal. The transmission tends to zero in the frequency range corresponding to P- and S-wave band gaps, as ... 詳細を見る
This example shows how to implement a stress dependent material model. The Young's modulus changes based on the stress value. 詳細を見る
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... 詳細を見る
In this example, two model for brittle damage are used to evaluate the fracture of a notched concrete beam subjected to three point bending. The results are compared with experimental data. 詳細を見る
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... 詳細を見る