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Composite materials are often used in structural applications because their properties, such as stiffness and strength, can be tailored to meet specific requirements. This makes them attractive alternatives to traditional engineering materials. Composites are also used in applications where both thermal and structural properties are important. One example is silicon wafers used in the electronics industry. Consequently, coupled thermal–structural analyses of thin structures are becoming increasingly important from a simulation perspective.

This example analyzes a laminated composite shell subjected to a deposited beam power heat source from both thermal and structural perspectives. The structural analysis uses a layerwise theory based approach. The example investigates how the position of the heat source affects the stress and deformation profiles.

In COMSOL Multiphysics, a structural analysis of a layered material can be performed using the Layered Shell interface, available with the Composite Materials Module. A thermal analysis of a layered material can be performed using the Heat Transfer in Shells interface, available with the Heat Transfer Module.