アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
This example shows how to model a deep excavation. The main application area of this type of modeling is in civil engineering. In this case, the in situ lateral pressure acting on the retaining wall during the soil excavation is modeled with boundary loads. The soil assumes Drucker ... 詳細を見る
In this classical benchmark model, a spherical scatterer is placed in a plane wave background field. When the sphere is modeled as sound hard, the problem has an analytical solution. The model compares the results using the Pressure Acoustics, Boundary Elements interface with the ... 詳細を見る
In this shape optimization example, the mass of a bracket is minimized by changing the size and position of a number of geometrical objects. The requirements give limits both on the lowest natural frequency, and on the maximum stress in a static load case. This means that results from ... 詳細を見る
Roller conveyors are commonly used in warehouses, manufacturing units and baggage handling applications to transport objects from one place to other by gravity, power, or manually. A typical roller conveyor consists of an array of moving rollers arranged either in a straight or curved ... 詳細を見る
In this example, the deformation of a rubber boot seal connected to a rigid pipe is studied. As the pipe rotates and the seal deforms, the flanges of the seal self-intersect and it also come into contact with the pipe. 詳細を見る
It is often not possible to insert a normal microphone directly into the sound field being measured. The microphone may be too big to fit inside the measured system, such as for in-the-ear measurements for hearing aid fitting. The size of the microphone may also be too large compared to ... 詳細を見る
The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components ... 詳細を見る
A thin-walled frame with a central cutout is subjected to a random load. Although the stresses are far below the yield level of the material, damage accumulates over the load history. The Rainflow counting algorithm is used to define the load scenario and Palmgren-Miner linear damage ... 詳細を見る
This is a benchmark model for a plane stress problem. The accuracy of the computed stress concentration is evaluated, and a mesh convergence study is performed for different element types. 詳細を見る
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... 詳細を見る
