Thermo-Mechanical Analysis of a Surface-Mounted Resistor
Application ID: 481
The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components producing heat it is a well-known problem that temperature cycling can lead to cracks propagating through the solder joints, resulting in premature failure.
For electronics in general there is a strong interest in changing the soldering material from lead- or tin-based solder alloys to other mixtures. This multiphysics example models the heat transport and structural stresses and deformations resulting from the temperature distribution using the Heat Transfer in Solids and Solid Mechanics interfaces.
This application was built using the following:伝熱モジュール 構造力学モジュール
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