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Heating Circuit

Application ID: 465

Small heating circuits find use in many applications. For example, in manufacturing processes they heat up reactive fluids. The device used consists of an electrically resistive layer deposited on a glass plate. The layer causes Joule heating when a voltage is applied to the circuit. The layer’s properties determine the amount of heat produced.

This multiphysics example simulates the electrical heat generation, the heat transfer, and the mechanical stresses and deformations of a heating circuit device. The model uses the Heat Transfer interface of the Heat Transfer module in combination with the Shell, Conductive Media DC interface from the AC/DC Module and the Solid, Stress-Strain and Shell interfaces from the Structural Mechanics Module.

This model is included as an example in the following products:

伝熱モジュール 構造力学モジュール

The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the 製品仕様一覧 and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.